浸镀Ni对Al/Cu双金属材料界面显微组织及力学性能的影响

来源期刊:中国有色金属学报(英文版)2014年第6期

论文作者:赵佳蕾 接金川 陈 飞 陈 航 李廷举 曹志强

文章页码:1659 - 1665

Key words:Al/Cu bimetal; immersion Ni plating; interface; diffusion bonding; intermetallics

摘    要:采用浸镀的方法在纯铝基体上浸镀镍基镀层,然后在450~550 °C温度范围内用扩散复合的方法制备Al/Cu双金属材料。用扫描电子显微镜(SEM)和X射线衍射仪(XRD)分别对Al/Cu结合体的界面显微组织以及断裂表面进行表征。用拉伸剪切测试及显微硬度测试对Al/Cu双金属材料的力学性能进行测量。结果表明,Ni中间层可以有效地消除Al-Cu金属间化合物的形成。Al/Ni界面由Al3Ni 和Al3Ni2两相组成,而在Ni/Cu界面处则是Ni-Cu固溶体。Ni中间层的加入提高了复层材料的拉伸剪切强度。在500 °C制备的添加Ni中间层的试样表现出最大的拉伸剪切值,为34.7 MPa。

Abstract: A nickel-based coating was deposited on the pure Al substrate by immersion plating, and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 °C. The interface microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests. The results show that the Ni interlayer can effectively eliminate the formation of Al-Cu intermetallic compounds. The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases, while it is Ni-Cu solid solution at the Ni/Cu interface. The tensile shear strength of the joints is improved by the addition of Ni interlayer. The joint with Ni interlayer annealed at 500 °C exhibits a maximum value of tensile shear strength of 34.7 MPa.

有色金属在线官网  |   会议  |   在线投稿  |   购买纸书  |   科技图书馆

中南大学出版社 主办 版权声明   电话:0731-88830515 88830516   传真:0731-88710482   Email:administrator@cnnmol.com

互联网出版许可证:(署)网出证(湘)字第028号   湘ICP备09001153号