铜在铜-铝合金界面的反应扩散研究

来源期刊：中南大学学报(自然科学版)1993年第3期

论文作者：曹显良 刘允中

文章页码：358 - 363

关键词：铜合金; 界面反应; 相

Key words：copper alloy; interface reaction; phase

摘    要：采用纯铜-(Cu-30wt%Al)组成的扩散偶,研究了800℃时Cu-Al反应扩散产物的扩散组织与时间之间的关系,并测定了显微硬度.结果表明,在800℃时Cu-Al界面反应产物与Cu-Al二元平衡相图中存在的各相相对应.

Abstract: By using the diffusion couple of pure copper and copper-30wt% aluminum, the relationstip between diffusion constructure of reaction products and time at 800℃ has been investigated, and the microhardnesses have also been measured. These results show that, at 800 ℃,interface reaction products of Cu-Al correspond to the vaviety phases in Cu-Al binary eguilirium phase diagram.