Sn-9Zn钎料与内加Cu质点和Cu基体界面生长行为-有色金属在线

简介概要

Sn-9Zn钎料与内加Cu质点和Cu基体界面生长行为

来源期刊：中国有色金属学报2007年第7期

论文作者：卫国强况敏杨永强赵利

文章页码：1083 - 1083

关键词：Sn-9Zn 钎料；无铅钎料；Cu质点；金属间化合物

Key words：Sn-9Zn solder; lead-free solder; Cu-particle; intermetallic compound (IMCs)

摘要：

在Sn-9Zn无铅钎料中加入Cu金属质点，研究在长时间钎焊条件下钎料/Cu质点、钎料/Cu基体界面金属间化合物(IMCs)的生长行为。结果表明：在钎料/Cu质点和钎料/Cu基体界面处都生成Cu-Zn相(IMCs)，其组成为Cu₅Zn₈+CuZn或Cu₅Zn₈，而且钎料/质点界面处IMCs的生长速度明显快于钎料/基体处；同时发现，Cu质点的加入大大减小了钎料/Cu基体界面IMCs的厚度。由于Cu质点原位生成Cu-Zn IMCs，消耗了焊点中的Zn，因此Sn-9Zn/Cu接头的可靠性得以提高。

Abstract: The growth behavior of interfacial intermetallic compounds (IMCs) of Sn-9Zn/additive Cu-particles and Sn-9Zn additive Cu-substrate was investigated under the condition of extended soldering time. The results show that the Cu-Zn phases, which are composed of Cu5Zn8 and CuZn or Cu5Zn8, are formed at the interfaces of both Sn-9Zn/Cu-particles and Sn-9Zn/Cu-substrate, simultaneously the growth rate of IMCs of Sn-9Zn/Cu-particles is markedly higher than that of Sn-9Zn/Cu-substrate. It is also shown that the addition of Cu-particles in Sn-9Zn solder greatly reduces the thickness of IMCs layer of Sn-9Zn/Cu-substrate. The reliability for Sn-9Zn/Cu joint is improved for the diminished Zn content in soldering joint due to the in-situ formation of IMCs of Sn-9Zn/Cu-particles.

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