磁场对Sn-9Zn钎料组织、显微硬度及电化学腐蚀的影响

来源期刊:中国有色金属学报2012年第2期

论文作者:吴敏 刘政军

文章页码:485 - 489

关键词:金属材料;Sn-9Zn钎料;锡合金;磁场;组织;显微硬度;电化学腐蚀

Key words:metallic materials; Sn-9Zn solder; Sn alloy; magnetic field; microstructure; microhardness; electrochemical corrosion

摘    要:运用X射线衍射仪、扫描电镜、电化学测试系统等研究0.125 T的静态磁场及旋转磁场对Sn-9Zn钎料的组织及性能影响。结果表明:静态磁场及旋转磁场均可促进Sn-9Zn钎料组织细化,其中旋转磁场可使Zn相分布呈旋转状;与未经磁场作用相比,静态磁场和旋转磁场可使Sn-9Zn钎料的显微硬度分别提高7.4%和10.2%,达到18.8 HV和19.3 HV;此外,经静态磁场及旋转磁场作用的钎料的腐蚀电位分别为-1.428和-1.450 V,比Sn-9Zn钎料的有所降低,而腐蚀电流密度分别为1.424×10-8和2.538×10-9 A/m2,相比Sn-9Zn钎料,其腐蚀电流密度明显减小,钎料腐蚀性能得到改善。

Abstract: The microstructure and property of Sn-9Zn solder were investigated under static magnetic field and rotary magnetic field of 0.125 T by XRD, SEM and electrochemical detector system. The results show that both static magnetic field and rotary magnetic field can refine the microstructure of Sn-9Zn solder, and Zn phase is rotating as well, the microhardness of Sn-9Zn solder under static magnetic field and rotary magnetic field increase by 7.4% and 10.2%, reaching to 18.8 HV and 19.3 HV, respectively, compared with the solder without magnetic field. While the corrosion potential of the solder under static magnetic field and rotary magnetic field decrease slightly and the corrosion current density obviously declines, which improves the solder corrosion property.

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