Adsorption of copper using macroporous phosphonic acid resin

来源期刊：中国有色金属学报(英文版)2003年第6期

论文作者：熊春华 吴香梅

文章页码：1446 - 1450

Key words：macroporous phosphonic acid resin; copper; adsorption; mechanism

Abstract: The adsorption behavior and mechanism of a novel chelate resin, macroporous phosphonic acid resin(PAR) for Cu(Ⅱ) were investigated. The statically saturated Cu(Ⅱ) adsorption capacity is 168mg/g resin at 298K in HAc-NaAc medium. The Cu(Ⅱ) adsorbed on PAR can be eluted by 1.0-3.0mol/L HCl and the elution percentage reaches 100%. The resin can be regenerated and reused without apparent decrease in adsorption capacity. The apparent adsorption rate constant is k=1.64×10^-4s^-1 at 298K. The adsorption behavior of PAR for Cu(Ⅱ) obeys the Freundlich isotherm. The thermodynamic adsorption parameters, enthalpy change ΔH, free energy change Δ/G/ and entropy change ΔS of PAR for Cu(Ⅱ) are 11.8kJ/mol, －2.0kJ/mol and 46.4J·mol^-1·K^-1 respectively. The apparent activation energy is E_a=8.0kJ/mol. The molar coordination ratio of the functional group of PAR to Cu(Ⅱ) is about 2∶1. The adsorption mechanism of PAR for Cu(Ⅱ) was examined by chemical method and IR spectrometry.