Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate

来源期刊：中国有色金属学报(英文版)2008年第1期

论文作者：田艳红 王春青 Y. Norman ZHOU

文章页码：132 - 137

Key words：copper wire; ultrasonic wedge bonding; bonding mechanism; wear action

Abstract: The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature. Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX, pull test, shear test and microhardness test. The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing. The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible, and the wedge bonding is achieved by wear action induced by ultrasonic vibration. The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.