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joints through ball shear test,high temperature storage,and temperature cycling.The shear strengths for Fee75Ni,Fee50Ni,and Fee30Ni solder joints after reflow were 42.57,53.94 and 53.98 MPa,respectively...Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder JointsHao Zhang1,Qing-Sheng Zhu1,Zhi-Quan Liu11. Institute of Metal Research, Chinese Academy of Sciences摘 要:
and solder ball placement[A]. Proceedings of the First IEMT/IMC Symposium[C]. Tokyo: The Organizing Committee, 1997. 174-181. [11]Lee J H, Lee Y H, Kim Y S. Fluxless laser reflow bumping of Sn-Pb eutectic...; 凸点; 无铅钎料; 重熔; 金属间化合物 中图分类号: TG111 文献标识码: A Interface reaction of solder droplet/pad and intermetallic compounds evolution during reflow soldering LI Fu-quan, WANG Chun-qing, TIAN Yan-hong, KONG......
Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability 钱乙余1,马鑫2 (1.National Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, China;2.National Key Laboratory of Reliability Physics of Electronic Product, Guangzhou 510610, China) Abstract:By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy......
Influences of fine pitch solder joint shape parameters on fatigue life under thermal cycle HUANG Chun-yue(黄春跃)1, 2, WU Zhao-hua(吴兆华)2,HUANG Hong-yan(黄红艳)2, ZHOU De-jian(周德俭)2 (1. School of Electro...) Abstract: The solder joint reliability of a 0.5mm lead pitch, 240-pin quad flat package(QFP) was studied by nonlinear finite element analysis(FEA). The stress/strain distributions within......
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Effect of ball milling on hydrogen storage of Mg3La alloy SUN Tai1,ZHU Min1,DONG Hanwu1,OUYANG Liuzhang1 (1.School of Mechanical Engineering, South China University of Technology, Guangzhou 510641, China) Abstract:Hydrogen storage and microstructure of ball milled Mg3La alloy were investigated by X-ray diffraction and pressure-composition-isotherm measurement. The ball milled Mg3La alloy could......
Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys ZHAO Xiao-yan(赵小艳), ZHAO Mai-qun(赵麦群), CUI Xiao-qing(崔小清), XU Tian-han(许天旱), TONG Ming-xin... properties and microstructures of Sn-3.0Ag-2.8Cu solder alloys added with micro-variable-Ce were studied by means of optical microscopy, scanning electron microscopy(SEM) and energy dispersive X-ray(EDX......
J. Cent. South Univ. (2020) 27: 711-720 DOI: https://doi.org/10.1007/s11771-020-4325-y Influence of cobalt content on microstructure and corrosion performance of extruded Sn-9Zn solder alloys JIANG... to the environmental concerns. The present work focuses on the effect of cobalt content (0, 0.5 and 3.0) on the microstructural characteristics, melting point and corrosion performance of extruded Sn-9Zn solder alloys......
