Solder joint geometry of tin-lead alloy and its application in electronic packaging
来源期刊:中国有色金属学报(英文版)1999年第4期
论文作者:王国忠 朱其农 程兆年 王春青 钱乙余
文章页码:733 - 740
Key words:tin-lead solders; solder joint geometry; simulation; thermal cycling life
Abstract: By employing the minimum energy theorem, the Potential energy controlling equation, which consists of surface energy and gravitational energy for molten meniscus, was investigated. The soder joint geometry of molten tin-lead soder alloy for chip component and thin quad flat package were simulated with finite element method. The simulation results 0f solder joint geometry are coincident well with the experimental results. The solder joint geometry was applied to study the solder joint reliability for chip component RC3216.The thermal cycling tests revealed that the solder joint geometry plays an important ro1e in solder joint reliability.