Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability
来源期刊：JOURNAL OF RARE EARTHS2002年第2期
论文作者：钱乙余 马鑫
Key words：rare earths; lanthanum; Cu6Sn5 intermetallic compound; solder joint reliability; thermodynamic;
Abstract: By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy, the growth of Cu6Sn5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0.18% is the limited value and 0.08% is the best value.
钱乙余1，马鑫2
(1.National Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, China;
2.National Key Laboratory of Reliability Physics of Electronic Product, Guangzhou 510610, China)
Abstract:By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy, the growth of Cu6Sn5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0.18% is the limited value and 0.08% is the best value.
Key words:rare earths; lanthanum; Cu6Sn5 intermetallic compound; solder joint reliability; thermodynamic;
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