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and characterization of mono-sized Sn-38wt% Pb alloy balls [J]. International J of Powder Metall, 1996, 32(2): 155-164. [3]Rocha J C. Control of the UDS process for the Production of Solder Balls for BGA...; Capillary wave formation on excited solder jet and fabrication of lead-free solder ball ZHANG Shu-guang(张曙光), HE Li-jun(何礼君), ZHU Xue-xin(朱学新......
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, China;2.National Key Laboratory of Reliability Physics of Electronic Product, Guangzhou 510610, China) Abstract:By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy... based on diffusion kinetics show that, the driving force for Cu6Sn5 growth is lowered by adding small content of La in Sn60-Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range......
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is also obviously improved even up to 15.7%. In sum, the optimum content of Ce is within 0.05%-0.1 %. Key words: Sn-Ag-Cu system; lead-free solder alloy; melting point; spreading property; mechanical... of various contents of Ce on microstructure and mechanical properties of Sn-Ag-Cu system solder alloys. 2 Experimental 2.1 Alloy design and preparation The raw materials are combined......
years[4－6]. Through controlling the temperature of solder droplet, appropriate bump can be fabricated when molten solder dropped to the metallization pad. Solder alloy redistribution and heating process... Abstract: Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow......
is analyzed in terms of the refined microstructure and the enhanced passive film stability. Key words: Sn-9Zn solder alloy; cobalt addition; extrusion; microstructure; corrosion performance Cite this article... to the eutectic Sn-38.1 wt.% Pb solder alloy (183 °C) [1-4]. Therefore, the preparation of Sn-Zn alloys requires less revision of the present manufacturing routes, which is favorable for industrial manufacturing......
utilized to improve the melting behaviors, microstructures, tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior of Sn-3.0Ag-0.5Cu alloy according to the differential thermal analysis (DTA) tests. The X-ray diffraction (XRD) patterns show that β-Sn, Ag3Sn and Cu6Sn5 coexist in the as-cast solder alloys and LaSn3 phases emerge......
:This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn- 9Zn-xP solder......
J. Cent. South Univ. (2016) 23: 1831-1838 DOI: 10.1007/s11771-016-3237-3 Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial... characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can......
