简介概要

Electrodeposition of aluminium and aluminium-copper alloys from a room temperature ionic liquid electrolyte containing aluminium chloride and triethylamine hydrochloride

来源期刊:International Journal of Minerals Metallurgy and Materials2013年第9期

论文作者:P.V. Suneesh T.G. Satheesh Babu T. Ramachandran

文章页码:909 - 916

摘    要:The electrodeposition of Al and Al-Cu binary alloys on to gold substrates from a room temperature ionic liquid electrolyte containing AlCl3-Et3NHCl was studied.The electrochemical behavior of the electrolyte and the mechanism of deposition were investigated through cyclic voltammetry(CV),and the properties of deposits obtained were assessed by scanning electron microscopy with energy dispersive X-ray spectroscopy(SEM-EDS) and X-ray difraction(XRD).Al of 70 μm in thickness and an Al-Cu alloy of 30 μm in thickness with 8at% copper were deposited from the electrolyte.SEM images of the deposits indicate that the Al deposit was smooth and uniform,whereas the Al-Cu deposit was nodular.The average crystalline size,as determined by XRD patterns,was found to be(30 ± 5) and(29 ± 5) nm,respectively,for Al and Al-Cu alloys.Potentiodynamic polarization(Tafel plots) and electrochemical impedance spectroscopic(EIS) measurements showed that Al-Cu alloys are more corrosion resistant than Al.

详情信息展示

Electrodeposition of aluminium and aluminium-copper alloys from a room temperature ionic liquid electrolyte containing aluminium chloride and triethylamine hydrochloride

P.V. Suneesh,T.G. Satheesh Babu,T. Ramachandran

Department of Sciences, Amrita School of Engineering, Amrita Vishwa Vidyapeetham, Amritanagar P. O.Coimbatore - 641112,India

摘 要:The electrodeposition of Al and Al-Cu binary alloys on to gold substrates from a room temperature ionic liquid electrolyte containing AlCl3-Et3NHCl was studied.The electrochemical behavior of the electrolyte and the mechanism of deposition were investigated through cyclic voltammetry(CV),and the properties of deposits obtained were assessed by scanning electron microscopy with energy dispersive X-ray spectroscopy(SEM-EDS) and X-ray difraction(XRD).Al of 70 μm in thickness and an Al-Cu alloy of 30 μm in thickness with 8at% copper were deposited from the electrolyte.SEM images of the deposits indicate that the Al deposit was smooth and uniform,whereas the Al-Cu deposit was nodular.The average crystalline size,as determined by XRD patterns,was found to be(30 ± 5) and(29 ± 5) nm,respectively,for Al and Al-Cu alloys.Potentiodynamic polarization(Tafel plots) and electrochemical impedance spectroscopic(EIS) measurements showed that Al-Cu alloys are more corrosion resistant than Al.

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