Nanotopography Impact in Shallow Trench Isolation Chemical Mechanical Polishing-Dependence on Slurry Characteristics
来源期刊：JOURNAL OF RARE EARTHS2004年增刊第2期
论文作者：Takeo Katoh Ungyu Paik Jea-Gun Park
Key words：CMP; slurry; ceria; abrasive; surfactant; nanotopography;
Abstract: The nanotopography of the surface of silicon wafers has become an important issue in ULSI device manufacturing since it affects the post-chemical mechanical polishing (post-CMP) uniformity of the thickness deviation of dielectric films. In this study, the nanotopography impact was investigated in terms of its dependence on the characteristics of ceriabased slurries, such as the abrasive size, the grain size of the polycrystalline abrasive and the surfactant added to the slurry. It was found that the magnitude of the post-CMP oxide thickness deviation due to nanotopography increased with the surfactant concentration in the case of smaller abrasives but was almost independent of the concentration in the case of larger abrasives. The grain size of the polycrystalline abrasive did not affect the nanotopography impact.
Takeo Katoh1，Ungyu Paik2，Jea-Gun Park1
(1.Nano-SOI Process Laboratory,Hanyang University,17 Haengdang-Dong,Seoungdong-Gu,Seoul 133-791,Korea;
2.Department of Ceramic Engineering,Hanyang University,17 Haengdang-Dong,Seoungdong-Gu,Seoul 133-791,Korea)
Abstract:The nanotopography of the surface of silicon wafers has become an important issue in ULSI device manufacturing since it affects the post-chemical mechanical polishing (post-CMP) uniformity of the thickness deviation of dielectric films. In this study, the nanotopography impact was investigated in terms of its dependence on the characteristics of ceriabased slurries, such as the abrasive size, the grain size of the polycrystalline abrasive and the surfactant added to the slurry. It was found that the magnitude of the post-CMP oxide thickness deviation due to nanotopography increased with the surfactant concentration in the case of smaller abrasives but was almost independent of the concentration in the case of larger abrasives. The grain size of the polycrystalline abrasive did not affect the nanotopography impact.
Key words:CMP; slurry; ceria; abrasive; surfactant; nanotopography;
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