简介概要

Effect of Ni content in Cu1-xNix coating on microstructure evolution and mechanical properties of W/Mo joint via low-temperature diffusion bonding

来源期刊:JOURNAL OF MATERIALS SCIENCE TECHNOLOG2020年第19期

论文作者:Mei Rao Guoqiang Luo Jian Zhang Yiyu Wang Qiang Shen Lianmeng Zhang

文章页码:171 - 180

摘    要:The 93 W and Mo1 refractory metals were bonded with different Cu1-xNix coating interlayers of various Ni content using plasma-activated sintering at 700?C. The effects of the Ni content in the Cu1-xNix coating interlayer on the interfacial microstructure evolution and mechanical properties of the W/Mo joints were studied. The maximum average shear strength of the W/Mo joint was 316.5 MPa when the Ni content of the Cu1-xNix coating interlayer was 25 %. When the Ni content of the Cu1-xNix coating interlayer was below 50 %, the atomic diffusion at the W/Mo joint interface was adequate without the formation of intermetallic compounds, as demonstrated by the High Resolution Transmission Electron Microscope analyses of the joints. The presence of Ni in Cu1-xNix promoted diffusion bonding at the interface, which contributed to the high mechanical properties of the W/Mo joint. With an increase in the Ni content of the Cu1-xNix coating interlayer, the Mo Ni intermetallic compound(IMC) nucleated and grew at the Cu1-xNix coating/Mo1 interface. When the Ni content of the Cu1-xNix coating interlayer was above 50 %,the generation of a brittle Mo Ni IMC weakened the shear strength of the W/Mo joint dramatically.

详情信息展示

Effect of Ni content in Cu1-xNix coating on microstructure evolution and mechanical properties of W/Mo joint via low-temperature diffusion bonding

Mei Rao1,Guoqiang Luo1,Jian Zhang1,Yiyu Wang2,Qiang Shen1,Lianmeng Zhang1

1. State Key Lab of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology2. Materials Science and Technology Division, Oak Ridge National Laboratory

摘 要:The 93 W and Mo1 refractory metals were bonded with different Cu1-xNix coating interlayers of various Ni content using plasma-activated sintering at 700?C. The effects of the Ni content in the Cu1-xNix coating interlayer on the interfacial microstructure evolution and mechanical properties of the W/Mo joints were studied. The maximum average shear strength of the W/Mo joint was 316.5 MPa when the Ni content of the Cu1-xNix coating interlayer was 25 %. When the Ni content of the Cu1-xNix coating interlayer was below 50 %, the atomic diffusion at the W/Mo joint interface was adequate without the formation of intermetallic compounds, as demonstrated by the High Resolution Transmission Electron Microscope analyses of the joints. The presence of Ni in Cu1-xNix promoted diffusion bonding at the interface, which contributed to the high mechanical properties of the W/Mo joint. With an increase in the Ni content of the Cu1-xNix coating interlayer, the Mo Ni intermetallic compound(IMC) nucleated and grew at the Cu1-xNix coating/Mo1 interface. When the Ni content of the Cu1-xNix coating interlayer was above 50 %,the generation of a brittle Mo Ni IMC weakened the shear strength of the W/Mo joint dramatically.

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