可剥离型载体超薄铜箔的研究现状

来源期刊：有色金属科学与工程2010年第2期

论文作者：邓庚凤 何桂荣 黄崛起 肖文仲

文章页码：22 - 24

关键词：超薄铜箔；剥离层；无机层；有机层

Key words：ultra-thin copper foil; peeling layer; inorganic layer; organic layer

摘    要：

超薄铜箔的生产大多采用具有一定厚度的载体箔作为阴极，在其上电沉积铜，形成超薄铜箔层．载体超薄铜箔生产的关键主要是解决载体与超薄铜箔剥离的问题，综述了载体超薄铜箔剥离层的研究现状，并对可剥离型超薄铜箔的发展作了展望。

Abstract: The production of ultra-thin copper foil mainly uses carrier foil with a certain thickness as the cathode,with electro-deposition of copper on it. The key technology of the ultra-thin copper foil production is the peeling of the ultra-thin copper foil from the carrier. This paper summarizes the current researches on the peeling layer between the ultra-thin copper foil and the carrier. The prospect for the ultra-thin copper foil production is also