Ni离子注入纯铜的表面改性

来源期刊:中国有色金属学报2008年第5期

论文作者:白亚奎 李杰池 郑瑞廷 程国安

文章页码:818 - 818

关键词:镍;铜;离子注入;表面改性

Key words:Ni; Cu; ion implantation; surface modification

摘    要:采用MEVVA源离子注入设备进行了纯铜表面镍离子注入的改性实验研究,采用透射电镜和X射线衍射仪对改性层显微组织进行分析表征。结果表明:随着Ni离子注入剂量的增加,铜表面改性层发生一系列强化过程。纳米硬度和摩擦磨损实验结果表明:当注入剂量达到7.5×1017 ion/cm2时,注入层的硬度值可达基体的2倍,滑动摩擦因数仅为基体的47%。高剂量的离子注入是对纯铜进行表面改性的一种有效的方法。

Abstract: The impact on the surface of pure copper performance with Nickel ion implantation was studied using MEVVA source ion implantation equipment. The microstructures of modified layer were analyzed by TEM and XRD. The results show that a series of strengthening process occur on the modified surface of copper with the increase of Ni ion implantation dose on surface of copper. The testing results of hardness and friction indicate that the surface hardness is 2 times as that of original copper surface when the ion implanted dose is 7.5×1017 ion/cm2, and the friction coefficient is only 47% of that of copper surface. It can be concluded that ion implantation on the surface of pure copper, especially strong current ion implantation, is an effective method of pure copper surface strengthening technology.

基金信息:国家自然科学基金资助项目

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