铜基材硝酸银溶液浸镀银的沉积过程

来源期刊：中国有色金属学报2008年第2期

论文作者：魏喆良 邵艳群 王欣 唐电

文章页码：372 - 372

关键词：浸镀银；电沉积；置换反应

Key words：immersion silver; electrodeposition; displacement

摘    要：

Abstract: The deposition rate and morphology of immersion silver plating onto copper substrate in silver nitrate aqueous solution were studied by galvanic current method and field emission scanning electron microscopy (FE-SEM). The results show that the whole deposition process can be divided into three stages：extending growth，transitional growth and dendritic growth. The deposition rate and morphology of Ag deposit are all different in each stage. Initially，the adhesive Ag atoms grow along the lattice of copper substrate. Secondly，the substrate is spread with initial silver crystal accompanied with two-dimension growth. Finally，coarse and sponge-like silver plating is prepared with dendritic growth.

基金信息：福建省重点国际合作资助项目