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, JIA Cheng-chang, HAN Yue-peng. Gel-casting on aluminium based alloys[J]. Powder Metallurgy Industry, 2007, 17(6): 28?32. [68] LIU Wei-hua, JIA Cheng-chang, SHI Yan-tao, HAN Yue-peng. Copper base......
. [48] MORCRETTE M, ROZIER P, DUPONT L, MUGNIER E, SNNIER L, GALY J, TARASCON J M. A reversible copper extrusion–insertion electrode for rechargeable Li batteries[J]. Nature Materials, 2003, 2: 755-761......
of the codeposition of gold and copper with inert particles[J]. Journal of Applied Electrochemistry, 1983, 13(4): 541-548. (编辑 何学锋) 基金项目:国家军品配套项目(JPPT-125-GH-039) 收稿日期:2012-07-12;修订日期:2012-09-14 通......
particles have been identified in 7xxx series Al alloys, such as the Fe- or Si-containing Al7Cu2Fe and Mg2Si phases. Copper contents are usually limited in 7xxx series alloys to curtail the formation......
合金&铜合金[M]. 2版. 北京: 中国标准出版社, 2001. Engineering materials and practical manual editing committee. Engineering materials and practical manual, titanium alloy and copper alloy[M]. 2nd ed. Beijing......
X. Micropen direct-write deposition of polyimide[J]. Microelectronic Engineering, 2009, 86(10): 1989-1993. [21] PARK B K, KIM D, JEONG S, MOON J, KIM J S. Direct writing of copper conductive patterns......
A, KAUTENBURGER R, SOLIOZ M, MUCKLICH F. Laser cladding of stainless steel with a copper-silver alloy to generate surfaces of high antimicrobial activity[J]. Applied Surface Science, 2014, 320: 195-199... mechanism of polycrystalline copper foil shocked with femtosecond laser [J]. Applied Surface Science, 2014, 309: 240-249. [77] GU C X, SHEN Z B, LIU H X, LI P, LU M M, ZHAO Y X, WANG X. Numerical......
Trans. Nonferrous Met. Soc. China 28(2018) 1887-1902 Thermal kinetic analysis of a complex process from a solid-state reaction by deconvolution procedure from a new calculation method and related thermodynamic functions of Mn0.90Co0.05Mg0.05HPO4·3H2O Chuchai SRONSRI, Banjong BOONCHOM Advanced Phosph......
of Materials Science Materials in Electronics, 2016: 1-35. [50] 张志鑫. Cu-Al化合物对SnAgCu焊点可靠性的影响[D]. 哈尔滨: 哈尔滨工业大学, 2014: 1-65. ZHANG Zhi-xin. Effect of copper-aluminum intermetallics on the reliability... temperature In-Bi-Zn solder alloy on copper substrate[J]. Journal of Materials Science: Materials in Electronics, 2016, 8(2): 1-8. [66] Shimizu K, Nakanishi T, Karasawa K, HASHIMOTO K, NIWA K. Solder joint......
REVIEW J. Cent. South Univ. (2019) 26: 268-288 DOI: https://doi.org/10.1007/s11771-019-4000-3 Industrial wastes applications for alkalinity regulation in bauxite residue: A comprehensive review XUE Sheng-guo(薛生国)1, WU Yu-jun(吴玉俊)1, LI Yi-wei(李义伟)1, KONG Xiang-feng(孔祥峰)1, ZHU Feng(朱锋)1, WILLIAM Har......