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-bin, LIANG Wen-jie, HE Yun-bin, LI Yun-chun, LU Cong-ge. Effect of La on intermetallic compounds of Sn-Ag-Cu lead-free alloy soldered with copper[J]. The Chinese Journal of Nonferrous Metals, 2008, 18......
and strength of ultra-fine-grained pure copper[J]. Advanced Materials, 2006, 18: 2949-2953. [110] LI Z, PRADEEP K G, DENG Y, RAABE D, TASAN C C. Metastable high-entropy dual-phase alloys overcome......
J. Cent. South Univ. (2020) 27: 674-697 DOI: https://doi.org/10.1007/s11771-020-4323-0 Effects of microstructural heterogeneity on fatigue properties of cast aluminum alloys JIAO Yi-nan(焦忆楠)1, 2, ZHANG Yi-fan(张依凡)2, 3, MA Shi-qing(马世卿)1, 2, SANG De-li(桑德利)1, 2, 4, ZHANG Yang(张洋)1, 2, ZHAO Jin-jin(......
-integrated circuit (IC) is reported without employing a dedicated bond stack [116]. In this report, using the copper pillar process, a μLED display driver IC, with a compact size of 3 mm×4.4 mm, has......
selection of absorbent layer for a thin film solar cell. Copper Indium Gallium Diselinide was the top ranked material. The findings were in agreement with the experimental results. Different normalization......