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, Wang G X, et al. Microstructural development in a rapidly cooled eutectic Sn-3.5%Ag solder reinforced with copper powder[J]. Powder Technology, 2006, 166(1): 38-46. [27] 刘平. 颗粒增强Sn3.8Ag0.7Cu复合无铅焊料的研究... nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure and copper[J]. Soldering & Surface Mount Technology, 2011, 23(3): 150-160. [56] Tsao L C, Chang S Y......
Trans. Nonferrous Met. Soc. China 27(2017) 1455-1475 Corrosion behavior and surface treatment of superlight Mg-Li alloys Yue-hua SUN, Ri-chu WANG, Chao-qun PENG, Yan FENG, Ming YANG School of Materials Science and Engineering, Central South University, Changsha 410083, China Received 9 March 2017; a......
of morphology evolution for bare and nano-CaCO3-coated Zn foils during Zn stripping/plating cycling[211](b) ZHI等[211]报道了一种多孔纳米CaCO3涂层作为缓冲层,获得均匀的锌金属镀层.图38(b)显示了在裸露的锌箔和CaCO3涂层包覆的锌箔镀锌的示意图.多孔纳米CaCO3涂层具有丰富的纳米孔道......
, JIA Cheng-chang, HAN Yue-peng. Gel-casting on aluminium based alloys[J]. Powder Metallurgy Industry, 2007, 17(6): 28?32. [68] LIU Wei-hua, JIA Cheng-chang, SHI Yan-tao, HAN Yue-peng. Copper base......
. [48] MORCRETTE M, ROZIER P, DUPONT L, MUGNIER E, SNNIER L, GALY J, TARASCON J M. A reversible copper extrusion–insertion electrode for rechargeable Li batteries[J]. Nature Materials, 2003, 2: 755-761......
of the codeposition of gold and copper with inert particles[J]. Journal of Applied Electrochemistry, 1983, 13(4): 541-548. (编辑 何学锋) 基金项目:国家军品配套项目(JPPT-125-GH-039) 收稿日期:2012-07-12;修订日期:2012-09-14 通......
particles have been identified in 7xxx series Al alloys, such as the Fe- or Si-containing Al7Cu2Fe and Mg2Si phases. Copper contents are usually limited in 7xxx series alloys to curtail the formation......
合金&铜合金[M]. 2版. 北京: 中国标准出版社, 2001. Engineering materials and practical manual editing committee. Engineering materials and practical manual, titanium alloy and copper alloy[M]. 2nd ed. Beijing......
X. Micropen direct-write deposition of polyimide[J]. Microelectronic Engineering, 2009, 86(10): 1989-1993. [21] PARK B K, KIM D, JEONG S, MOON J, KIM J S. Direct writing of copper conductive patterns......
景, 黄 昆, 陈奕然. 铂族金属硫化矿或其浮选精矿提取铂族金属及铜镍钴: 中国, CN1234889 C[P]. 2006-01-04. CHEN Jing, HUANG Kun, CHEN Yi-ran. Extraction of platinum group metals and copper, nickel and cobalt from platinum group metal......