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渐增多,钎料合金性能下降. 关键词:Bi5Sb钎料合金；Cu；润湿性能；力学性能 中图分类号:TG 405 文献标识码:A Effect of content of Cu on wettability and mechanical property of Bi5Sb solder alloy YAN... of Cu into Bi5Sb solder alloy to improve its wettability and mechanical properties. The results show the effect of adding 0.5%?5.0% (mass fraction) Cu into Bi5Sb on the melting point of Bi5Sb solder alloy......
IR reflow soldering method. Key words: diode-laser soldering; Sn-Ag-Cu lead-free solder; shear force; microstructure 1 Introduction With low cost, Sn-Pb alloy has been widely used in electronic... and the environment, and recent concerns over the toxicity of Sn-Pb solder alloy result in the development of new lead-free solder alloys for electronic packaging[1,2]. Among several lead-free candidate......
better shear strength than that of SAC105 solder alloy.关键词:...Modification of Sn–1.0Ag–0.5Cu solder using nickel and boronJun-Feng Qu1,2,Jun Xu1,2,Qiang Hu1,2,Fu-Wen Zhang1,2,Shao-Ming Zhang1,21. National Engineering Research Center for Nonferrous Metal......
要利, 张柯柯, 李臣阳, 衡中皓. RE对SnAgCu钎料合金及焊点性能的影响[J]. 材料热处理学报, 2011, 32(12): 35-37.WANG Yao-li, ZHANG Ke-ke, LI Chen-yang, HENG Zhong-hao. Effect of RE on properties of SnAgCu solder alloy and its joints[J..., as well as decrease of the shear strength. When the Ni adding content of solder alloy is 0.05% (mass fraction), the roughness and average thickness of IMC are the lowest, the shear strength is the highest......
Effect of Rare Earth Elements on Solidification Microstructure and High Temperature Mechanical Property of Sn60-Pb40 Solder alloy () [全文内容正在添加中] ......
(IMC) interfacial layer of soldered joints between Sn2.5Ag0.7CuxRE lead-free solder and copper substrate usually includes two parts of Cu6Sn5 near the solder alloy, and Cu3Sn nearside the Cu substrate. Adding tiny RE in Sn2.5Ag0.7Cu lead-free solder alloy can refine the microstructure of the solder joints and affect the size and configuration of the IMC of interfacial layer. When the RE adding......
and TC4 soft alloy [J].Transactions of the China Welding Institution, 2009, 30(2): 117-120. [12] KOEBEL M M, HAWI N E, LU J, GATTIKER F, NEUENSCHWANDER J. Anodic bonding of activated tin solder alloys... s-1,拍摄过程2 s,超声辅助铺展设备示意图如图2所示. 图1 液态钎料动态铺展示意图 Fig. 1 Schematic diagram of dynamic spreading of liquid solder 图2 超声辅助铺展设备示意图 Fig. 2 Schematic diagram of experimental device......
Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn–Zn–Cu Solder AlloyBismarck Luiz Silva1,Rodrigo Valenzuela Reyes2,Amauri Garcia3,Jos Eduardo Spinelli21. Department... Engineering,University of Campinas,UNICAMP摘 要:The present investigation is based on the results of a directionally solidified(DS) Sn–9 wt%Zn–2 wt%Cu alloy......
Break-up Process of Perturbed Molten Metal Jet and Preparation of Lead-Free Solder Balls He Lijun1,Shi Likai1,Zhang Shaoming1,Xu Jun1,Zhang Shuguang1 (1.National Engineering Research Center for Non-Ferrous Metals Composites,General Research Institute for Non-Ferrous Metals,Beijing 100088,China) Abstract:Solder balls, which are used in advanced electronics packages such as BGA (Ball Grid Array......
solder alloy, much more Sn3O(OH)2Cl2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints. The leaching test confirmed... the electrochemical corrosion property of Sn-9Zn- 1.5Ag-1Bi alloy/Cu joint in 3.5% NaCl solution and found that some pits formed at solder/substrate interfaces. In our previous work [12,13......
