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• Electronic packaging materials prepared by powder injecting molding and pressure infiltration process

  来源： 《Rare Metals2007年第6期》——YIN Fazhang), GUO Hong), JIA Chengchang), XU Jun), ZHANG Ximin), and ZHU Xuexin) ) National Engineering and Technology Research Center for Nonferrous Metals Composites, Beijing General Research Institute for Nonferrous Met-als, Beijing , China ) Materials Science and Engineering School, University of Science and Technology Beijing, Beijing , China

  Electronic packaging materials prepared by powder injecting molding and pressure infiltration processYIN Fazhang1), GUO Hong1), JIA Chengchang2), XU Jun1), ZHANG Ximin1), and ZHU Xuexin1) 1) National... School, University of Science and Technology Beijing, Beijing 100083, China摘 要:AlSiCp (65 vol.% SiC) electronic packaging materials were manufactured by powder......

• Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy technique

  来源： 《Rare Metals2020年第11期》——Yan-Qiang Liu Jian-Zhong Fan Xin-Xiang Hao Shao-Hua Wei Jun-Hui Nie Zi-Li Ma Ming-Kun Liu Ya-Bao Wang

  Advanced hermetic electronic packaging based on lightweight silicon/aluminum composite produced by powder metallurgy techniqueYan-Qiang Liu,Jian-Zhong Fan,Xin-Xiang Hao,Shao-Hua Wei,Jun-Hui Nie,Zi-Li...="ChDivSummary">Silicon/aluminum(Si/Al) composite is a kind of lightweight electronic packaging material that received a lot of attention in the past 20 years.In this paper,a series of Si/Al composites......

• Localized CO₂ laser bonding process for MEMS packaging

  来源： 《中国有色金属学报(英文版)2006年第z1期》——SUN Li A. P. MALSHE S. CUNNINGHAM A. MORRIS

  and Electronic Packaging, 1999, 22(3): 233-241. [3] MERCADO L L, LEE T T, KUO S M, LEE R. Process-induced thermal effect on packaging yield of RF MEMS switches[A]. American Society of Mechanical Engineers, EEP, v 2, Electronic and Photonic Packaging, Electrical Systems and Photonics Design and Nanotechnology[C]. New Orleans: ASME, 2002, 25-32. [4] DE SILVA A. P, LIU L, HUGHES H G. Impact of Thermal Cycles......

• Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

  来源： 《Rare Metals2011年第1期》——ZHANG Ximin,GUO Hong,YIN Fazhang,FAN Yeming,and ZHANG Yongzhong National Engineering Research Center for Nonferrous Metals Composites,General Research Institute for Non-ferrous Metals,Beijing ,China

  Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applicationsZHANG Ximin,GUO Hong,YIN Fazhang,FAN Yeming,and ZHANG Yongzhong National Engineering Research Center for Nonferrous Metals Composites,General Research Institute for Non-ferrous Metals,Beijing 100088,China摘 要:Diamond/Cu-xCr composites were......

• Solder joint geometry of tin-lead alloy and its application in electronic packaging

  来源： 《中国有色金属学报(英文版)1999年第4期》——王国忠 朱其农 程兆年 王春青 钱乙余

  ......

• 含高体积分数SiC_p的铝基复合材料制备与性能

  来源： 《中国有色金属学报2003年第5期》——张强 陈国钦 武高辉 姜龙涛 栾伯峰

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• 具有双层结构的电子封装用可激光 焊接Si_p-SiC_p/Al混杂复合材料

  来源： 《中国有色金属学报(英文版)2014年第4期》——朱梦剑 李 顺 赵 恂 熊德赣

  Trans. Nonferrous Met. Soc. China 24(2014) 1032-1038 Laser-weldable Sip-SiCp/Al hybrid composites with bilayer structure for electronic packaging Meng-jian ZHU, Shun LI, Xun ZHAO, De-gan XIONG... packaging applications. The gas tightness of components after laser welding (48 mPa×cm3)/s) can well match the requirement of advanced electronic packaging. Several kinds of these precision components......

• Property measurements on spray formed Si-Al alloys

  来源： 《中国有色金属学报(英文版)2007年第2期》——魏衍广 熊柏青 张永安 刘红伟 王锋 朱宝宏

  by spray forming process for electronic packaging. Property measurements on spray-formed Si-Al alloys after hot pressing were carried out. The results indicate that the alloys (Si-(30%-40%)Al) have... with gold finishes and soldered with Sn-Pb alloy without any difficulty. Key words: spray forming; Si-Al alloy; electronic packaging material; coefficient of thermal expansion     ......

• Infiltration kinetics of pressureless infiltration in SiC_p/Al composites

  来源： 《中国有色金属学报(英文版)2005年第2期》——秦振凯 于家康 张小宇

  composites; pressureless infiltration; kinetics; electronic packaging CLC number: TB333 Document code: A electronic packaging and thermal management[1]. Electronic packaging materials are required to possess compatible CTEs with the IC, thus the composites with high volume fraction......

• 混杂2D-C/Al电子封装复合材料的设计与制备

  来源： 《中国有色金属学报2000年第z1期》——于家康 周尧和

  and fabrication of hybrid 2D-C/Al composites for electronic packaging Abstract: The size and volume fraction of silicon carbide particle in hybrid C/ SiCp per-form were designed, and hybrid 2D-C/Al electronic packaging composites of non-wetting system were fabricated by low pressure infiltration. Theoretical calculation shows that the SiCp with volume fraction of 0.5%~2......