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• Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder

  来源： 《Journal Of Wuhan University Of Technology Materials Science Edition2009年第2期》——黄惠珍

  Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder黄惠珍School of Materials Science and Engineering, Nanchang University摘 要:Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu5Zn8 particles are formed and distributed uniformly......

• Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle Fatigue

  来源： 《Acta Metallurgica Sinica2017年第9期》——Noritake Hiyoshi

  Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle FatigueNoritake HiyoshiDivision of Engineering, Faculty of Engineering, University of Fukui摘 要:In this study, a crack initiation and propagation behavior of Sn–5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push–pull loading tests with a single-hole specimen......

• Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining

  来源： 《JOURNAL OF MATERIALS SCIENCE TECHNOLOG2011年第11期》——X.F. Zhang), H.Y. Liu), J.D. Guo) and J.K. Shang,) ) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang , China ) Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL , USA

  Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic PrestrainingX.F. Zhang1), H.Y. Liu1), J.D. Guo1) and J.K. Shang1,2) 1) Shenyang National Laboratory for Materials..., USA摘 要:Plastic prestraining was applied to a solder interconnect to introduce internal defects such as dislocations in order to investigate the interaction......

• Structure and magnetic properties of Nd_1.5Fe_10.5Mo_1.5N_x prepared by mechanical milling

  来源： 《中国有色金属学报(英文版)2000年第1期》——张久兴 杨洪川 周美玲 左铁镛

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• W-Ni-Fe nanostructure materials synthesized by high energy ball milling

  来源： 《中国有色金属学报(英文版)2000年第1期》——范景莲 黄伯云 曲选辉

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• Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics

  来源： 《材料导报2020年第14期》——张墅野

  Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics张墅野State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology摘 要:<正>Wearable electronics in future necessarily assemble integrated circuits (ICs) on printed circuit board (PCB) or flexible printed circuit (FPC) substrates[1]. Before......

• 苛刻热循环对Sn2.5Ag0.7Cu0.1RExNi/Cu钎焊界面及接头性能的影响

  来源： 《中国有色金属学报2016年第12期》——郭兴东 张柯柯 邱然锋 石红信 王要利 马宁

  Fig. 1  Configuration and dimension of specimen for soldering (Unit: mm) 图2  接头界面粗糙度示意图 Fig. 2  Schematic diagram of roughness of solder joints 参照文献[6]中关于微连接焊点界面厚度,粗糙度的评估方法(界面IMC粗糙度测量示意...Cu3Sn相的生长驱动力.接头界面处IMC内存在少量气孔,裂纹等缺陷.无铅焊点界面IMC作为连接的基础,其几何形态,尺寸与微连接焊点可靠性密切相关[11],在此,重点考虑苛刻热循环对接头界面界面金属间化合物尤其是(Cu,Ni)6Sn5的影响. 表1  图3(a)中焊点界面EDS分析结果 Table 1  EDS results of solder joint interface......

• 超声振幅对石英玻璃表面钎料铺展行为的影响

  来源： 《中国有色金属学报2019年第4期》——马志鹏 于海洋 许志武 袁月 崔巍 闫久春

  s-1,拍摄过程2 s,超声辅助铺展设备示意图如图2所示. 图1  液态钎料动态铺展示意图 Fig. 1  Schematic diagram of dynamic spreading of liquid solder 图2  超声辅助铺展设备示意图 Fig. 2  Schematic diagram of experimental device... Fig. 3  Schematic diagram of meshing results 图4  钎料液滴流体区域模型 Fig. 4  Model of fluid area of solder droplet 钎料液滴数值模拟所采用的参数包括:钎料液滴直径为6 mm,二维流体区域40 mm×20 mm,超声施加时间为2 s,加热温度为220 ℃.石英玻璃弹性模量为72......

• Cu含量对Bi5Sb钎料润湿性能和力学性能的影响

  来源： 《中国有色金属学报2009年第6期》——闫焉服 冯丽芳 郭晓晓 唐坤 赵培峰

  渐增多,钎料合金性能下降. 关键词:Bi5Sb钎料合金；Cu；润湿性能；力学性能 中图分类号:TG 405       文献标识码:A Effect of content of Cu on wettability and mechanical property of Bi5Sb solder alloy   YAN... of Cu into Bi5Sb solder alloy to improve its wettability and mechanical properties. The results show the effect of adding 0.5%?5.0% (mass fraction) Cu into Bi5Sb on the melting point of Bi5Sb solder alloy......

• Role of grain orientation in the failure of Sn-based solder joints under thermomechanical fatigue

  来源： 《Acta Metallurgica Sinica2012年第3期》——Jing HAN, Hongtao CHEN and Mingyu LI ( State Key Laboratory of Advanced Welding Production Technology, Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen , China)

  Role of grain orientation in the failure of Sn-based solder joints under thermomechanical fatigueJing HAN, Hongtao CHEN and Mingyu LI ( State Key Laboratory of Advanced Welding Production Technology, Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen 518055, China)摘 要:A small Pb-free solder joint exhibits an extremely strong anisotropy......