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and characterization of mono-sized Sn-38wt% Pb alloy balls [J]. International J of Powder Metall, 1996, 32(2): 155-164. [3]Rocha J C. Control of the UDS process for the Production of Solder Balls for BGA...; Capillary wave formation on excited solder jet and fabrication of lead-free solder ball ZHANG Shu-guang(张曙光), HE Li-jun(何礼君), ZHU Xue-xin(朱学新......
to the difficulties in preparing Sn-Ag-Cu nano or micron powder, the reports regarding Sn-Ag-Cu micron- (or nano-) powdered solder are very limited, especially no report can be referred to the effect.... The solidus, wettability and spreadability of the fine solder powder were investigated in order to assess the effect of Ce on the properties of lead-free Sn-Ag-Cu- Ce micron- (or nano-) powdered solder. 2 ......
Interfacial reactions between Sn-2.5Ag-2.0Ni solder and electroless Ni(P) deposited on SiCp/Al composites WU Mao(吴 茂), QU Xuan-hui(曲选辉), HE Xin-bo(何新波), Rafi-ud-din, REN Shu-bin(任淑彬), QIN Ming...) layers. It is observed that variation of P contents in the electroless Ni(P) layer results in different types of microstructures of SnAgNi/Ni(P) solder joint. The morphology of Ni3Sn4 intermetallic......
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Effect of solidification on solder bump formation in solder jet process: Simulation and experiment TIAN De-wen(田德文), WANG Chun-qing(王春青), TIAN Yan-hong(田艳红) School of Materials...; Abstract: To investigate the influence of the solidification on the solder bump formation......
Break-up Process of Perturbed Molten Metal Jet and Preparation of Lead-Free Solder Balls He Lijun1,Shi Likai1,Zhang Shaoming1,Xu Jun1,Zhang Shuguang1 (1.National Engineering Research Center for Non-Ferrous Metals Composites,General Research Institute for Non-Ferrous Metals,Beijing 100088,China) Abstract:Solder balls, which are used in advanced electronics packages such as BGA (Ball Grid Array......
and performance of Sn-Ag-Cu lead-free BGA solder joint YANG Miao-sen1, 2, SUN Feng-lian1, KONG Xiang-xia1, ZHOU Yun-fang1 (1. School of Material Science and Engineering, Harbin University of Technology, Harbin... ball grid array(BGA) solder joint. The ratio of plastic strain to total strain was used to characterize the solder plasticity. SAC305/Cu, SAC0307 /Cu and SAC0705BiNi/Cu component solder joints were......
,在本试验条件下,导液管突出高度最佳为4 mm. 关键词:无铅焊锡粉末; 气体雾化; 导液管突出高度; 粉末特性; Sn-Ag-Cu lead-free solder powder; gas atomizing; protrusion height of delivery tube; powder properties; [全文内容正在添加中] ......
Effect of Lanthanum on Driving Force for Cu6Sn5 Growth and Improvement of Solder Joint Reliability 钱乙余1,马鑫2 (1.National Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, China;2.National Key Laboratory of Reliability Physics of Electronic Product, Guangzhou 510610, China) Abstract:By means of adding low content of rare earth element La into Sn60-Pb40 solder alloy......
Abstract: Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results show that the wetting reaction between molten solder droplet and pad leads to the formation of Au-Sn compound at interface, but Au element is not fully consumed......
