一种新型电解铜箔无砷粗化工艺研究

来源期刊：有色金属科学与工程2012年第2期

论文作者：黄永发 王平 唐云志 李立清

文章页码：1 - 4

关键词：电解铜箔；无砷粗化；添加剂

Key words：electrolytic copper foil; arsenic-free coarsening; additives

摘    要：为了寻找新的复合添加物和工艺路线来替换现有电解铜箔粗化工艺中含砷添加剂的使用，通过对电解铜箔生产的现场模拟，探索了粗化基础配方、添加剂含量、电流密度、温度等对粗化层表面的影响；利用金相显微镜，研究了无砷粗化工艺的最佳配方及电镀条件。对比试验结果表明，利用硫酸亚锡和钨酸钠等作为复合添加剂，能够取代原有工艺中含砷添加剂，取得很好的环保效果。

Abstract:

This paper studies the effects of coarsening layer surface based on the basic components of plating solution, additive content, current density and temperature by simulating the technology of electrolytic copper foil production to find a new complex additives and routes replacing the arsenic additives in the existing coarsening technology of copper foil. The best formula and condition of arsenic-free coarsening technology is researched by comparing the coarsening effect from metallurgical microscope. The experimental results show that the new complex additives of stannous sulfate and sodium tungstate can replace the arsenic additives in the existing technology by achieving superior environmental performance.