Numerical simulation on thixoforging of electronic packaging shell with SiC_p/A356 composites

来源期刊：中国有色金属学报(英文版)2010年第9期

论文作者：王开坤 汪富玉 陈学军 王璐 马春梅

文章页码：1707 - 1711

Key words：thixo-forming; SiC_p/A356 composites; electronic packaging shell; numerical simulation

Abstract: Based on the research of modern electronic packaging materials, thixo-forming technology was used to fabricate electronic packaging shell. The process of thixo-extrusion with SiC_p/A356 composites was simulated by the finite element software DEFORM-3D, then the flow velocity field, equivalent strain field and temperature field were analyzed. The electronic packaging shell was manufactured by extrusion according to the results from numerical simulation. The results show that thixo-forming technology can be used in producing electronic package shell with SiC_p/A356 composites, and high volume fraction of SiC_p with homogeneous distribution can be achieved, being in agreement with the requirements of electronic packaging materials.