Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass

来源期刊：中国有色金属学报(英文版)2007年增刊第1期(Part ⅡB)

论文作者：张会平 江中浩 连建设 侯旭峰

文章页码：736 - 740

Key words：nanocrystalline copper; electroless plating; surface roughness; electrical resistivity

Abstract: Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). The results indicate that the copper films have a (111) texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs–Sondheimer (F–S), Mayadas–Shatzkes (M–S) theory and a combined model, the grain boundary reflection coefficient (R) is calculated in the range of 0.40-0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces.

基金信息：the National Basic Research and Development Program and Project 985-Automotive Engineering of Jilin University