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Low cycle fatigue improvement of powder metallurgy titanium alloy through thermomechanical treatment LIU Bin(刘 彬)1, LIU Yong(刘 咏)1, HE Xiao-yu(何小禹)1, TANG Hui-ping(汤慧萍)2, CHEN Li-fang(陈丽芳)1 1. State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China; 2. State Key Laboratory of Porous Materials Technology, Xi’an 710016, China Received 5 June 2007......
Properties and forming process of prealloyed powder metallurgy Ti-6Al-4V alloy WANG Liang(王 亮)1, LANG Ze-bao(郎泽保)1, SHI Hong-pei(史鸿培)1 Aerospace Research Institute of Material and Processing Technology, Beijing 100076, China Received 15 July 2007; accepted 10 September 2007 Abstract: The properties and forming process of prealloyed powder metallurgy (PM) Ti-6Al-4V alloy were......
J. Cent. South Univ. (2020) 27: 334-343 DOI: https://doi.org/10.1007/s11771-020-4299-9 Microstructure and tensile property of SLM 316L stainless steel manufactured with fine and coarse powder... 2020 Abstract: Selective laser melting (SLM) technology is the prevailing method of manufacturing components with complex geometries. However, the cost of the additive manufacturing (AM) fine powder......
Effects of Micro-Amount of Cerium on Microstructures of Sn-Ag-Cu Solder and Soldered Joint韩宗杰,薛松柏,刘琳,王俭辛,吴玉秀,黄翔,王慧摘 要:Effects of micro-amount of rare earth Ce on microstructures of Sn-3.0Ag-0.5Cu solder alloy were studied. The results indicate that microstructures of Sn-Ag-Cu-Ce solder alloy are composed of Sn-rich phase and eutectic structures......
J. Cent. South Univ. (2020) 27: 1611-1623 DOI: https://doi.org/10.1007/s11771-020-4394-y New development of powder metallurgy in automotive industry TAN Zhao-qiang(谭兆强)1, 2, ZHANG Qing(张青)2, GUO Xue-yi(郭学益)3, ZHAO Wei-jiang(赵伟江)1, ZHOU Cheng-shang(周承商)1, LIU Yong(刘咏)1 1. State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China; 2. Hoganas (China) Co., Ltd......
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Modification of Sn–1.0Ag–0.5Cu solder using nickel and boronJun-Feng Qu1,2,Jun Xu1,2,Qiang Hu1,2,Fu-Wen Zhang1,2,Shao-Ming Zhang1,21. National Engineering Research Center for Nonferrous Metal... in volume fraction of primary Sn increasing and the grain size decreasing observably. It is found that a large number of fine reinforcement particles with network-like shape are found in the solder......
Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin FilmsJ.K.ShangShenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of SciencesDepartment of Materials Science and Engineering,University of Illinois at Urbana-Champaign摘 要:The thermodynamic conditions for dewetting of a liquid solder drop......
Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG JointsM.L.Huang,F.YangElectronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology摘 要:Solder size effect on early stage interfacial intermetallic compound(IMC) evolution......
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