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crystal and grow up. Additionally, the Vickers hardness test shows that fine β-Sn and spherical Ag3Sn phase in the rapidly solidified alloy strongly improves the microhardness of the Sn-3.5%Ag solder... needle-like Ag3Sn IMCs formed in solder. Here a Sn-3.5%Ag eutectic alloy was used as an example for investigating the influence of cooling rates on the microstructure of solders and the inherent......
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphereMingna Wang1,Chuang Qiao2,3,Xiaolin Jiang2,Long Hao3,4,Xiahe Liu21. Department of Physics...) solder in electronics worked in marine atmospheric environment and the uneven distribution of Ag3Sn and Cu6Sn5 intermetallic compounds(IMCs) in β-Sn matrix, comb-like electrodes have been designed......
="ChDivSummary">The reactive spreading processes of Sn–17Bi–0.5Cu melt alloy on Cu substrate were studied by sessile drop method in the temperature range of 523–673 K.Dynamic contact angles between the solder...Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrateBing-Sheng Xu1,Li-Kun Zang2,Zhang-Fu Yuan3,Yan Wu3,Zhou Zhou41. Beijing Key Laboratory......
Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder黄惠珍School of Materials Science and Engineering, Nanchang University摘 要:Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu5Zn8 particles are formed and distributed uniformly......
Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle FatigueNoritake HiyoshiDivision of Engineering, Faculty of Engineering, University of Fukui摘 要:In this study, a crack initiation and propagation behavior of Sn–5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push–pull loading tests with a single-hole specimen......
Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic PrestrainingX.F. Zhang1), H.Y. Liu1), J.D. Guo1) and J.K. Shang1,2) 1) Shenyang National Laboratory for Materials..., USA摘 要:Plastic prestraining was applied to a solder interconnect to introduce internal defects such as dislocations in order to investigate the interaction......
Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics张墅野State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology摘 要:<正>Wearable electronics in future necessarily assemble integrated circuits (ICs) on printed circuit board (PCB) or flexible printed circuit (FPC) substrates[1]. Before......
Alloy 20不锈钢薄板等离子弧焊接工艺研究赵斌,王宾宾,王小华中国船舶重工集团公司第七二五研究所摘 要:对Alloy 20不锈钢薄板进行了等离子弧焊接工艺试验研究.结果表明,采用等离子弧焊接方法,ERCr Ni Mo-3焊材及合理的焊接工艺参数,等离子弧焊接工艺可用于Alloy 20不锈钢薄板的焊接,焊接接头各项性能均能满足要求.关键词:Alloy 20;不锈钢薄板;等离子弧焊接;......
Role of grain orientation in the failure of Sn-based solder joints under thermomechanical fatigueJing HAN, Hongtao CHEN and Mingyu LI ( State Key Laboratory of Advanced Welding Production Technology, Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen 518055, China)摘 要:A small Pb-free solder joint exhibits an extremely strong anisotropy......
Bi Layer Formation at the Anode Interface in Cu/Sn-58Bi/Cu Solder Joints with High Current DensityHongwen He 1), Haiyan Zhao 1) , Fu Guo 2) and Guangchen Xu 2) 1) Department of Mechanical Engineering... layer formation in Cu/Sn–58Bi/Cu solder joints was investigated with different current densities and solder thickness. Uniform and continuous Bi layers were formed at the anode interface which......
