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• 铋对SAC305-xBi/Cu焊接接头显微组织、热性能、力学性能和界面行为的影响

  来源： 《中国有色金属学报(英文版)2021年第5期》——Suchart CHANTARAMANEE Phairote SUNGKHAPHAITOON

  melt temperature SnZn and SnBi solder alloys for electronic interconnections [J]. Journal of Alloys and Compounds, 2016, 665: 251-260. [9] SUGANUMA K. Advances in lead-free electronics soldering [J... reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy [J]. Materials & Design, 2014, 55: 837-845. [12] EL-DALY A A, EL-TAHER A M, DALLOUL T R. Enhanced ductility and mechanical strength of Ni-doped......

• Sn-2.5Ag-0.7Cu(0.1RE)/Cu焊点界面区微观组织与Cu₆Sn₅的生长动力学

  来源： 《中国有色金属学报2009年第4期》——王要利 张柯柯 韩丽娟 温洪洪

  特性[J]. 特种铸造及有色合金, 2006, 26(9): 604-606.FAN Yan-li, ZHANG Ke-ke, WANG Shuang-qi, CHENG Guang-hui, WANG Yao-li, YU Yang-chun. Wettability of Sn-Ag-Cu lead-free solder containing low Ag for different..., ZHAO Xin-hua. Study on the optimal free-lead solder alloy of Sn-Ag-Cu system[J]. Electronic Components & Materials, 2004, 23(8): 14-21. [4] 张柯柯, 王双其, 余阳春, 王要利, 樊艳丽. Sn-Ag-Cu-RE系无铅钎料与表面贴装元器件的润湿适配性[J......

• Sn-9Zn-3Bi/Cu 钎焊接头在170℃时效过程中的显微结构

  来源： 《中国有色金属学报2004年第5期》——段莉蕾 于大全 赵杰 王来

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• Mechanical and electrical properties of In-Bi solder at Bi₂₂₁₂ superconductor interface with annealed Ag spray layers and Ag precoating layers

  来源： 《中国有色金属学报(英文版)2009年第4期》——Seung-Yong SHIN Ji-Hyun LEE Hai-Woong PARK

  at the interface between superconductor and shunt metal to maintain good electrical properties. In this perspective, In-Bi solder is one of the good representatives as the lead-free solder which has a low..., APPLEGATE D S, HUANG Q. A resistive fault current limiter based on high temperature superconductors [J]. Applied Superconductivity, 1995, 3: 469-482. [4] LEE H Y. Lead-free solder alloys [J]. J......

• Sb含量对Sn-Bi系焊料性能的影响

  来源： 《中国有色金属学报(英文版)2014年第1期》——张 成 刘思栋 钱国统 周 健 薛 烽

  increases as the Sb content increases. Key words: lead-free solder; Sn-Bi-Sb alloy; microstructure; melting behavior; wettability 1 Introduction Solder material plays a crucial role in providing..., especially when the Sb content exceeds 2%. References [1] ZHANG Shu-guang, HE Li-jun, ZHANG Shao-ming, SHI Li-kai. Progress of research and application of lead-free solder [J]. Materials Review, 2004, 18(6......

• 银元素对含银钎料性能的影响

  来源： 《中国有色金属学报2016年第11期》——王禾 薛松柏 刘霜

  . Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys[J]. Scripta Materialia, 2003, 48(8): 1047-1051. [10] 吴文云, 邱小明, 殷世强, 孙大谦, 李明高. Bi, Ag 对 Sn-Zn 无铅钎料性能与组织的影响[J]. 中国有色金属学报, 2006, 16(1): 158-163. WU Wen-yun, QIU Xiao-ming, YIN Shi-qiang, SUN Da-qian, LI Ming-gao. Influence of Bi, Ag on microstructure and properties of Sn-Zn lead-free solder[J]. The Chinese Journal of Nonferrous......

• Finite element simulation for mechanical response of surface mounted solder joints under different temperature cycling

  来源： 《中国有色金属学报(英文版)2001年第4期》——马鑫 钱乙余 F. Yoshida

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• Sn-9Zn-xP无铅焊料合金性能研究

  来源： 《材料工程2010年第3期》——周浪 黄惠珍 帅歌旺 魏秀琴

  Sn-9Zn-xP无铅焊料合金性能研究 周浪1,黄惠珍1,帅歌旺2,魏秀琴1 (1.南昌大学,材料科学与工程学院,南昌,330031;2.南昌航空大学,材料科学与工程学院,南昌,330063) 摘要:以Sn-9Zn合金为研究对象,考察了P的添加对其性能的影响,并对其机制作了初步探讨.通过二次离子质谱(SIMS)分析发现,P的添加显著降低Sn-9Zn合金中的含氧量,从而提高了合金在Cu上的润湿性.P的改善润湿性的效果不仅有利于其工艺性能,也提高了Sn-9Zn/Cu焊点界面的结合强度,只使其塑性略有下降.同时,微量P的添加不改变Sn-9Zn合金与Cu形成的焊点的界面结构.另外,蠕变强度测试结果表明,P的添加能显著提高合金的抗蠕变性能. 关键词:Sn-Zn合金; 无铅焊料; P; 润湿性; 蠕变; Sn-Zn alloy; lead-free solder; phosphorus......

• 晶圆级芯片尺寸封装Sn-3.0Ag-0.5Cu焊点跌落失效模式

  来源： 《中国有色金属学报(英文版)2016年第6期》——黄明亮 赵宁 刘爽 何宜谦

  to be the most popular lead-free solders [5-7]. Since portable consumer electronics are frequently shocked and dropped in service, crack and even fracture may occur in solder joints or package... and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices [J]. Microelectronics Reliability, 2014, 54(1): 281-286. [3] ZHANG Cheng, LIU Si-dong, QIAN Guo-tong, ZHOU......

• Sn–xAg无铅焊料中Ag 含量对其显微组织、腐蚀行为和与Cu基体界面反应的影响

  来源： 《中国有色金属学报(英文版)2019年第8期》——Phacharaphon TUNTHAWIROON Kannachai KANLAYASIRI

  are being replaced by the binary and ternary lead-free Sn-based solder systems. The binary solder system is realized by incorporating alloying elements (e.g., Zn, Bi, In, Cu, Ag) into the Sn-based solder... soldering, which in turn hindered the growth of brittle intermetallic layer of Cu6Sn5 [14,22]. Specifically, near eutectic Sn-3.5Ag (wt.%) lead-free solder is commonly used in the electronic industry due......