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of IMCs of Sn-9Zn/Cu-particles. Key words: Sn-9Zn solder; lead-free solder; Cu-particle; intermetallic compound (IMCs) ... lead-free solders and common base materials[J]. Mater Sci Eng R, 2005, R49: 1-60. [2] Abtew M, Selvaduray G. Lead-free solders in microelectronics[J]. Mater Sci Eng A, 2000, A27(1): 85-141. [3......
; 文献标志码:A Effect of Fe particles on microstructures and properties of Sn-3Ag-0.5Cu lead-free solder LIU Xiao-ying, MA Hai-tao, LUO Zhong-bing, ZHAO Yan-hui... increases approximately 25% as a result of incorporation of Fe particles. Key words: composite lead-free solder; Sn-3Ag-0.5Cu; viscosity; wettability; shear strength 为进一步开发新型无铅钎料和改善现有无铅钎料性能,复合无铅钎料的研究已成......
and 5.38×10-18 m2/s, respectively, which has significant effect on the growth behavior of intermetallic compounds during aging. Key words: lead-free solder; interfacial reaction; isothermal aging；IMC...铅焊料合金Sn-Zn-Ga的研究[J]. 稀有金属材料与工程,2004,33(11):1222. CHEN Guo-hai, LI Xiao-yan, GENG Zhi-ting. The study on the new type lead-free solder alloys Sn-Zn-Ga[J]. Materials and Engineering of Rare Metal, 2004......
文献标志码:A Microstructure and mechanical properties of C89320 lead-free bismuth tin bronze DONG Xiu-wen, LI Yan (Entry-Exit Inspection and Quarantine Bureau of Liaoning Province, Dalian 116001, China) Abstract: The macrostructure, microstructure and mechanical properties of C89320 lead-free bismuth tin bronze were investigated by OPM, SEM and EDS......
Trans. Nonferrous Met. Soc. China 22(2012) s133-s137 Structure and piezoelectric properties of (1-x)K0.5Na0.5NbO3-xLiBiO3 lead-free piezoelectric ceramics JIANG Min-hong1, 2, 3, DENG Man-jiao1, YANG... Abstract: Lead-free piezoelectric ceramics (1-x)(K0.5Na0.5)NbO3-xLiBiO3 [(1–x)KNN-xLB] (x=0, 0.0005, 0.002, 0.004, 0.006, 0.008, 0.010) were prepared by an traditional solid-state reaction......
, 表明Sn-6.5Zn在Sn-Zn系中具有最好的钎焊工艺性能. 关键词: Sn-Zn合金; 无铅焊料; 润湿性; 抗拉强度; 延伸率; 焊点强度 中图分类号: TG4 文献标识码: A Properties of Sn-Zn alloys as lead-free solders WEI Xiu-qin, HUANG Hui-zhen, ZHOU Lang, ZHANG Meng...-Zn alloys investigated. Key words: Sn-Zn alloys; lead-free solder; wettability; tensile strength; elongation; joint strength 经过近10年的努力, 世界范围内电子用无铅焊料的研制和发展取得了令人瞩目的成就. 人们不仅筛选出可能代替传统共晶Sn......
instead of Wood alloy. Key words: lead-free solder; fusible alloy; melting temperature; mechanical property; thermal actuator 控温易熔合金是指熔点低于232℃(Sn的熔点), 熔化范围窄且具有钎焊能力的合金, 广泛用于制作电器, 消防, 火灾报警装..., 206. [2]Abtew M, Selvaduray G. Lead-free solders in microelectronics[J]. Materials Science and Engineering R: Reports, 2000, 27(5-6): 95-141. [3]Yoon S W, Choi W K, Lee H M. Calculation of surface......
. 关键词:水热合成; 无铅压电陶瓷; 微波水热合成; hydrothermal synthesis; lead-free piezoceramics; microwave-hydrothermal synthesis; [全文内容正在添加中] ......
, the (CuxNi1-x)6Sn5 layer is formed at the solder/pad interface during reflow. Key words: solder droplet; bump; lead-free solder; reflow; intermetallic compound 球栅阵列, 倒扣芯片等面阵列封装技术的关键为凸点制作[1-3], 凸点的... are distributed into solder matrix, and Ni layer is exposed to solder and reacts with solder directly. Distinctive difference exists between the intermetallics formed at Pb-free solder/pad interface and SnPb......
