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alloys and Al-Zn alloys) and the different reinforcement including metallics (i.e., Al-Fe-Cr quasicrystal and TNM), and ceramics (i.e., Fe2O3, Al2O3, TiC, SiC, AlN, TiB2 and carbon nanotubes......
电子元器件非常相近[6],主要用于对热导率和气密性要求较高的场合,是电子封装中常用的基片材料[4].当今已投入使用的陶瓷基片主要有Al2O3,BeO,Si3N4,SiC和AlN等.其中Al2O3基片价格低廉,强度,硬度,化学稳定性和耐热冲击性能高,绝缘性和与金属附着性良好,是目前电子行业中综合性能较好,应用最成熟的陶瓷材料,占 陶瓷基片总量的90%.但是Al2O3陶瓷热导率相对较低,热膨胀系数和......
]. However, the manufacturing process of IMCs is very complex and cost-intensive. 4.4 Ceramics Ceramics including graphite, aluminosilicate refractories, AlN, Si3N4, and Al2O3 are widely used for aluminum......
[13-16]. During the last three decades, TiC, AlN, B4C, Al2O3, TiB2, MoS2, SiC, Gr and mica, have widely used as the reinforcement particles at various mesh sizes in the aluminium matrix which improved......