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• Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing process

  来源： 《Rare Metals2011年第6期》——WEI Xiaofeng,WANG Richu,FENG Yan,ZHU Xuewei,and PENG Chaoqun School of Materials Science and Engineering,Central South University,Changsha ,China

  Microstructural evolution of Au-Sn solder prepared by laminate rolling during annealing processWEI Xiaofeng,WANG Richu,FENG Yan,ZHU Xuewei,and PENG Chaoqun School of Materials Science and Engineering... investigated during annealing at 453,523,and 543 K for up to 240 h.The Au/Sn combination formed a rapid diffusion system.Even in rolled Au-Sn solder,three phases,such as AuSn,AuSn2,and AuSn4,were formed.After......

• Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern

  来源： 《JOURNAL OF MATERIALS SCIENCE TECHNOLOG2010年第12期》——K.J.Hsia

  Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel PatternK.J.HsiaDepartment of Mechanical Science and Engineering,University of Illinois at Urbana-Champaign,Urbana,IL 61801,USA摘 要:The reactive Sn63Pb37 spreading on patterned film structures was examined in a reducing atmosphere(H2 5%+Ar 95%).Liquid solder spreading was observed to follow......

• Effects of Ga,Al,Ag,and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solder

  来源： 《Rare Metals2009年第6期》——WANG Huia, XUE Songbaia, ZHAO Fengb, and CHEN Wenxuea a College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing , China b Department of Materials, Loughborough University, Leicestershire, LE TU, UK

  Sn-9Zn-0.2Ga-0.002Al-0.25Ag- 0.15Ce solder and Cu substrate were investigated by scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS) analysis. The SEM images illustrate that the IMCs can be divided into two portions from the substrate side to the solder side: a planar Cu5Zn8 layer and an additional continuous scallop-like AgZn3 layer. The EDS analysis also shows that Ga segregates in the solder......

• Sn-Ag-Cu无铅球栅阵列焊点塑性表征

  来源： 《中国有色金属学报2015年第11期》——杨淼森 孙凤莲 孔祥霞 周云芳

  and performance of Sn-Ag-Cu lead-free BGA solder joint YANG Miao-sen1, 2, SUN Feng-lian1, KONG Xiang-xia1, ZHOU Yun-fang1 (1. School of Material Science and Engineering, Harbin University of Technology, Harbin... ball grid array(BGA) solder joint. The ratio of plastic strain to total strain was used to characterize the solder plasticity. SAC305/Cu, SAC0307 /Cu and SAC0705BiNi/Cu component solder joints were......

• Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration

  来源： 《JOURNAL OF MATERIALS SCIENCE TECHNOLOG2016年第11期》——M.Nasir Bashir A.S.M.A.Haseeb Abu Zayed Mohammad Saliqur Rahman M.A.Fazal

  Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to ElectromigrationM.Nasir Bashir,A.S.M.A.Haseeb,Abu Zayed Mohammad Saliqur Rahman,M.A.FazalDepartment of Mechanical Engineering, University of Malaya摘 要:Rapid Cu diffusion is one of the main causes of electromigration(EM) failure in lead-free solder......

• 倒装芯片中凸点与凸点下金属层反应的研究现状

  来源： 《材料导报2005年第9期》——何大鹏 于大全 王来 赵杰 马海涛

  倒装芯片中凸点与凸点下金属层反应的研究现状 何大鹏1,于大全1,王来1,赵杰1,马海涛1 (1.大连理工大学材料工程系,大连,116023) 摘要:随着当代电子封装技术的飞速发展以及无铅化潮流的兴起,倒装芯片中凸点(Solder Bump)与凸点下金属层(UBM)之间的反应的研究成为当前研究的热点.综述了UBM与凸点反应研究的最新进展,总结了钎焊过程中的界面反应和元素扩散行为,分析了界面金属间化合物层(IMC)在长时间回流焊接过程中剥落的原因,进一步指出了凸点与UBM反应研究的趋势. 关键词:凸点凸点下金属层(UBM); 金属间化合物(IMC); 剥落; [全文内容正在添加中] ......

• Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal Behavior

  来源： 《Journal Of Wuhan University Of Technology Materials Science Edition2019年第3期》——赖彦青 胡小武 LI Yulong JIANG Xiongxin

  Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal Behavior赖彦青,胡小武,LI Yulong,JIANG Xiongxin摘 要:solder alloys were investigated. The Cu6 Sn5 IMC could be observed as long as the molten solder contacted with the Cu......

• 激光喷射钎料球键合焊点界面组织及其可靠性分析

  来源： 《金属学报2010年第9期》——王晓林 李明雨 王春青

  激光喷射钎料球键合焊点界面组织及其可靠性分析王晓林1,李明雨1,王春青2(1.广东省深圳市哈尔滨工业大学深圳研究院材料学科部2.哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨150001)摘 要:采用激光喷射钎料球键合技术以及Sn3.0Ag0.5Cu(质量分数,%)无Pb钎料球对厚Au焊盘进行了键合实验.采用SEM和EDS对焊点界面的微观组织进行了分析.采用冷热循环处理研究了焊点微观组织的演变及其对接头强度的影响.结果表明,由于钎焊过程的热量有限,导致焊盘上的Au层不能全部溶解到钎料中去,界面处形成Au+......

• Electromigration in eutectic SnAg solder reaction couples with various ambient temperatures and current densities

  来源： 《International Journal of Minerals Metallurgy and Materials2009年第6期》——Guang-chen Xu, Fu Guo, and Wan-rong Zhu College of Materials Science and Engineering, Beijing University of Technology, Beijing , China

  Electromigration in eutectic SnAg solder reaction couples with various ambient temperatures and current densitiesGuang-chen Xu, Fu Guo, and Wan-rong Zhu College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China摘 要:The electromigration behavior of eutectic SnAg solder reaction couples was studied at various......

• Sn-3.5Ag/Cu体系早期界面反应及凝固过冷行为

  来源： 《金属学报2010年第5期》——周敏波 李勋平 马骁 张新平

  Sn-3.5Ag/Cu体系早期界面反应及凝固过冷行为周敏波1,李勋平1,马骁1,张新平1(1.广东省广州市华南理工大学材料科学与工程学院)摘 要:利用差示扫描量热分析法结合焊点回流过程,研究了无Pb钎料Sn-3.5Ag与Cu基底构成的Sn-3.5Ag/Cu体系模拟焊点中早期界面反应及焊点形成过程中钎料熔化和凝固特性.结果表明,加热过程中Cu向钎料合金侧的固态原子扩散导致界面生成低熔点Sn-Ag-Cu三元合金,使焊点界面在低于Sn-3.5Ag钎料熔点温度近4℃时即开始熔化;早期界面反应促使润湿过程提早发生并生成了......