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Preparation and performance research of Ce-TiO2/KL ball photocatalysts于晓娟1,熊领领1,马国平2,梁愿1,刘奎仁11. School of Materials and Metallurgy Northeastern University2. School of Science Changchun University of Science and Technology摘 要:The Ce-TiO2/KL(diatomite) ball photocatalyst was prepared and characterized based on the pretreated diatomite. The results showed......
Fabrication of Lead Zirconate Titanate Powder Using Ultrasonic Ball Milling Technique Wandee Thamjaree1,W. Nhuapeng1,T. Tunkasiri1 (1.Department of Physics, Faculty of Science, Chiang Mai University, Chiang Mai 50200, Thailand) 摘要:In this research, the ultrasonic ball milling technique has been used to fabricate lead zirconate titanate (PZT) ceramics.PZT with the composition nearly......
Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapesPing Chen1,Xiu-Chen Zhao1,Ying Liu1,Hong Li1,Yong Wang21. School of Materials Science... on the aging resistance and mechanical properties of Sn3.0 Ag0.5 Cu(SAC)solder bump joints were investigated by high-temperature aging test and shear test.Three different SAC solder bump joints with barrel......
Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad WANG Jian-xin(王俭辛)1, XUE Song-bai(薛松柏)1, FANG Dian-song(方典松)2, JU Jin-long..., China Received 12 March 2006; accepted 22 August 2006 Abstract: Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow......
Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder jointsGuo-qiang Wei,Lei Wang,Xin-qiang Peng,Ming-yang XueSchool of Mechanical and Automotive... of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni(SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu(SAC305)/ Cu solder joints aging at 373,403,and 438 K.The results show that(Cu1 x,Nix)6Sn5phase......
Effect of ball milling on hydrogen storage of Mg3La alloy董汉武,欧阳柳章,孙泰,朱敏摘 要:Hydrogen storage and microstructure of ball milled Mg3La alloy were investigated by X-ray diffraction and pres- sure-composition-isotherm measurement. The ball milled Mg3La alloy could absorb hydrogen up to 4wt.% at 300 °C for the first time, along with a decomposing course......
of Technology,Harbin 150001,China摘 要:Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu(SAC) solder powders,mixing with flux and reflowing at 260 ℃ for 60 s.The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were......
, Sb等低熔点金属和微量Ce, La等稀土元素以降低贵金属In和Ag的含量, 进一步提高无铅锡基多元合金钎料的综合性能和性能价格比. 关键词: 钎料合金; 无铅钎料; 相图; 相图计算 中图分类号: TG113.14 文献标识码: A Design of lead-free solder alloy and alloy phase diagram calculation QIAO... of Materials and Metallurgical Engineering, Kunming University of Science and Technology, Kunming 650093, China) Abstract: The principles for lead-free solder alloy design and the importance of phase......
Microstructure and mechanical property of Sn–Ag–Cu solder materialYi-Gang Kong1,Zhi-Gang Kong21. School of Mechanical Engineering, Taiyuan University of Science and Technology2. Research Laboratory of Electrical Contacts, Beijing University of Posts and Telecommunications摘 要:Among the lead-free solder materials,Sn-AgCu alloys have many advantages......
Ball Milling Synthesis and Property of Nd0.7Sr0.3MnO3 ManganitesShunsheng Chen1), Changping Yang1), Lingfang Xu1) and Shaolong Tang2) 1) The Provincial Key Laboratory of Piezoelectric Ceramics..." name="ChDivSummary">Strontium doped perovskite-type Nd0.7Sr0.3MnO3 ceramics were synthesized completely by high-energy ball milling raw oxides of Nd2O3, SrCO3 and MnO2. The optimal ball milling time......
