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• Rapidly solidified hypereutectic Al-Si alloys prepared by powder hot extrusion

  来源： 《中国有色金属学报(英文版)2002年第5期》——李元元 张大童 张卫文

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• Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapes

  来源： 《Rare Metals2021年第1期》——Ping Chen Xiu-Chen Zhao Ying Liu Hong Li Yong Wang

  Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapesPing Chen1,Xiu-Chen Zhao1,Ying Liu1,Hong Li1,Yong Wang21. School of Materials Science... on the aging resistance and mechanical properties of Sn3.0 Ag0.5 Cu(SAC)solder bump joints were investigated by high-temperature aging test and shear test.Three different SAC solder bump joints with barrel......

• SYNTHESIS OF Ti-47Al-2Cr-2Nb ALLOY THROUGH ELEMENTAL POWDER METALLURGY

  来源： 《中国有色金属学报(英文版)1998年第4期》——Liu Yong Huang Baiyun He Yuehui

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• TiAl ALLOYS PREPARED BY THERMAL EXTRUSION OF ELEMENTAL POWDER MIXTURES

  来源： 《中国有色金属学报(英文版)1997年第1期》——Liu Zhijian Qu Xuanhui Huang Baiyun

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• Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

  来源： 《中国有色金属学报(英文版)2006年第6期》——王俭辛 薛松柏 方典松 鞠金龙 韩宗杰 姚立华

  Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad WANG Jian-xin(王俭辛)1, XUE Song-bai(薛松柏)1, FANG Dian-song(方典松)2, JU Jin-long..., China Received 12 March 2006; accepted 22 August 2006 Abstract: Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow......

• Preparation and characterization of nanometer-sized barium titanate powder by complex-precursor method

  来源： 《中南大学学报(英文版)2008年第3期》——石爱华 颜文斌 李佑稷 黄可龙

  J. Cent. South Univ. Technol. (2008) 15: 334-338 DOI: 10.1007/s11771-008-0063-2 Preparation and characterization of nanometer-sized barium titanate powder by complex-precursor method SHI Ai-hua...;       Abstract: A new complex-precursor method was proposed to prepare nanometer-sized BaTiO3 powder. Firstly, [Ti2O(O2)2(ta)2]4- complex ions were prepared......

• Die wall lubricated warm compaction of iron-based powder metallurgy material

  来源： 《中国有色金属学报(英文版)2002年第6期》——倪东惠 陈维平 肖志瑜 温利平 吴苑标

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• Fabrication and characteristics of magnesium alloys produced via powder metallurgy

  来源： 《中国有色金属学报(英文版)2000年第6期》——曹鹏 Li LU Man On LAI

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• Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

  来源： 《International Journal of Minerals Metallurgy and Materials2013年第9期》——Guo-qiang Wei Lei Wang Xin-qiang Peng Ming-yang Xue

  Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder jointsGuo-qiang Wei,Lei Wang,Xin-qiang Peng,Ming-yang XueSchool of Mechanical and Automotive... of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni(SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu(SAC305)/ Cu solder joints aging at 373,403,and 438 K.The results show that(Cu1 x,Nix)6Sn5phase......

• Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder

  来源： 《JOURNAL OF MATERIALS SCIENCE TECHNOLOG2012年第7期》——Wei Zhang ,Ying Zhong and Chunqing Wang State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin ,China

  of Technology,Harbin 150001,China摘 要:Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu(SAC) solder powders,mixing with flux and reflowing at 260 ℃ for 60 s.The spreading areas of composite solder were calculated and the distributions of copper-coated diamonds were......