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Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin FilmsJ.K.ShangShenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of SciencesDepartment of Materials Science and Engineering,University of Illinois at Urbana-Champaign摘 要:The thermodynamic conditions for dewetting of a liquid solder drop......
Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG JointsM.L.Huang,F.YangElectronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology摘 要:Solder size effect on early stage interfacial intermetallic compound(IMC) evolution......
University摘 要:Effects of Zn, Zn-Al and Zn-P additions on melting points, microstructures, tensile properties, and oxidation behaviors of Sn-40 Bi lead-free solder were investigated. The experimental results show that the addition of these three types of elements can refine the microstructures and improve the ultimate tensile strength(UTS) of solder alloys......
Microstructure,wetting property of Sn-Ag-Cu-Bi-xCe solder and IMC growth at solder/Cu interface during thermal cyclingYuan Wang1,Xiu-Chen Zhao1,Ying Liu1,Yong Wang1,2,Dong-Mei Li21. School... of adding small amounts of cerium(Ce) to Sn-3.3 Ag-0.2 Cu-4.7 Bi solder on microstructure,wettability characteristic,interfacial morphology and the growth of interfacial intermetallic compound(IMC......
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphereMingna Wang1,Chuang Qiao2,3,Xiaolin Jiang2,Long Hao3,4,Xiahe Liu21. Department of Physics...) solder in electronics worked in marine atmospheric environment and the uneven distribution of Ag3Sn and Cu6Sn5 intermetallic compounds(IMCs) in β-Sn matrix, comb-like electrodes have been designed......
Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder黄惠珍School of Materials Science and Engineering, Nanchang University摘 要:Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu5Zn8 particles are formed and distributed uniformly......
Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle FatigueNoritake HiyoshiDivision of Engineering, Faculty of Engineering, University of Fukui摘 要:In this study, a crack initiation and propagation behavior of Sn–5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push–pull loading tests with a single-hole specimen......
Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic PrestrainingX.F. Zhang1), H.Y. Liu1), J.D. Guo1) and J.K. Shang1,2) 1) Shenyang National Laboratory for Materials..., USA摘 要:Plastic prestraining was applied to a solder interconnect to introduce internal defects such as dislocations in order to investigate the interaction......
on the properties of SnAgCu solder alloys. The addition of 0.03% (mass fraction) rare earth Ce into SnAgCu solder may improve its mechanical properties, but slightly lower its melting temperature... are in good agreement with the theoretical ones. Key words: rare earth Ce; SnAgCu solder; creep behavior; constitutive equations ......
Solder Anisotropic Conductive Films for Prospective Wearable and 5G/Artificial Electronics张墅野State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology摘 要:<正>Wearable electronics in future necessarily assemble integrated circuits (ICs) on printed circuit board (PCB) or flexible printed circuit (FPC) substrates[1]. Before......
