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accelerates the crystallization and growing up of IMC. Key words: lead-free solder; Sn-Ag-Cu alloy; IMC thickness; uniform design ..., 2006, and almost all Japanese major electric and electronic manufacturing companies will finish their development of lead free soldering [1]. To replace the traditional solder Sn-Pb alloys, the lead......
Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle FatigueNoritake HiyoshiDivision of Engineering, Faculty of Engineering, University of Fukui摘 要:In this study, a crack initiation and propagation behavior of Sn–5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push–pull loading tests with a single-hole specimen......
410083, China) Abstract: The effects of minor La on the formation and growth behaviors of intermetallic compounds at Sn-3.0Ag-0.5Cu lead-free solder alloy/copper substrate interface and inside... are precipitated along the eutectic bonds after aging. Key words: Sn-Ag-Cu lead-free solder; La; soldering; aging; intermetallic compound ......
]. Materials Science and Engineering R, 2002, 38(2): 55-105. [3] ZOU C D, GAO Y L, YANG B, ZHAI Q J. Melting and solidification properties of nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy[J]. Materials... particulate-reinforced lead-free solder composite[J]. Journal of Materials Science & Processing, 2006, 22(4): 529-532. [9] 李仕明, 余 春, 陆 皓. 锗元素对Sn-3.5Ag合金/铜界面反应的影响[J]. 机械工程材料, 2009, 33(9): 21-24.LI Shi......
and 5.38×10-18 m2/s, respectively, which has significant effect on the growth behavior of intermetallic compounds during aging. Key words: lead-free solder; interfacial reaction; isothermal aging；IMC...铅焊料合金Sn-Zn-Ga的研究[J]. 稀有金属材料与工程,2004,33(11):1222. CHEN Guo-hai, LI Xiao-yan, GENG Zhi-ting. The study on the new type lead-free solder alloys Sn-Zn-Ga[J]. Materials and Engineering of Rare Metal, 2004......
of IMCs of Sn-9Zn/Cu-particles. Key words: Sn-9Zn solder; lead-free solder; Cu-particle; intermetallic compound (IMCs) ...] Suganuma K. Advance in lead-free electronics soldering[J]. Current Opinion in Solid State Materials Science, 2001, 5(1): 55-64. [4] Zeng K, Tu K N. Six cases of reliability of Pb-free solder joints......
(IMC) interfacial layer of soldered joints between Sn2.5Ag0.7CuxRE lead-free solder and copper substrate usually includes two parts of Cu6Sn5 near the solder alloy, and Cu3Sn nearside the Cu substrate. Adding tiny RE in Sn2.5Ag0.7Cu lead-free solder alloy can refine the microstructure of the solder joints and affect the size and configuration of the IMC of interfacial layer. When the RE adding......
calculation; electromigration; SnBi lead-free solder; elemental doping 由于微处理器和其他电子消费品的小型化及高性能集成化的趋势,作为起到电流导通作用的焊料凸点和焊料连接点处的电流密度可达到约104 A/cm2.在如此高的电流密度下,电迁移极易发生,已有大量文献报道了高密度电流通过焊点导致焊点的阴极界面上出现孔洞,最终使得器件失效... of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China) Abstract: The first-principles calculations on the elemental doping in SnBi lead-free solders were performed, aiming to inhabit......
,在本试验条件下,导液管突出高度最佳为4 mm. 关键词:无铅焊锡粉末; 气体雾化; 导液管突出高度; 粉末特性; Sn-Ag-Cu lead-free solder powder; gas atomizing; protrusion height of delivery tube; powder properties; [全文内容正在添加中] ......
；Sn-3.0Ag-0.5Cu；Er；组织；性能 中图分类号:TG 42 文献标识码:A Effect of Er on microstructure and properties of Sn-3.0Ag-0.5Cu lead-free solder alloy LU Bin, LI Hui, WANG Juan-hui, ZHU Hua-wei... and is refined. And the suitable content of Er is within 0.05%-0.25%. Key words: lead-free solder; Sn-3.0Ag-0.5Cu; Er; microstructure; property ......
