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is focused in materials science for long time. With the development of lead-free in electronic devices, the problems resulting from tin whiskers are going up. The spontaneous growth of tin whiskers can... way for whisker growth trend, and some way to the mitigation whisker growth in the industry. Key words: plating; tin whisker; growth mechanism; lead-free solders 锡晶须在镀层表面自发生长现象最早由COMPTON等[1]于1951年报......
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EVOLUTION OF MICROSTRUCTURE OF Sn-Ag-Cu LEAD-FREE FLIP CHIP SOLDER JOINTS DURING AGING PROCESS C.Q. Wang1,Y.H. Tian1,W.F. Zhou1 (1.State Key Lab of Advanced Welding Production and Technology,Harbin...) on the characteristics of interfacial IMCs was weakened when subjected to the aging process. Key words:lead free solder; flip chip; aging; [全文内容正在添加中] ......
Comparative study of 2mol% Li- and Mn-substituted lead-free potassium sodium niobate ceramicsDipti3,44. School of Physics & Material Sciences, Thapar University摘 要:The effect of Li and Mn substitution on the dielectric, ferroelectric and piezoelectric properties of lead free K0.5Na0.5Nb O3(KNN) was investigated. Samples were prepared using......
Effects of Ga,Al,Ag,and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solderWANG Huia, XUE Songbaia, ZHAO Fengb, and CHEN Wenxuea a College of Materials Science and Technology...="ChDivSummary">An orthogonal method was used to evaluate the effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solders by wetting balance method. The results show......
of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5×10-5 to 2×10-2 s-1, and its stress-strain curves were compared... conditions. Key words: lead free solder; Sn-3.5Ag alloy; Sn-37Pb alloy; constitutive model; tensile; FEM analysis; thermal cycle reliability ......
: A Wetting match performance of SnAgCuRE lead-free solder for surface mount component ZHANG Ke-ke, WANG Shuang-qi, YU Yang-chun, WANG Yao-li,FAN Yan-li, CHENG Guang-hui, HAN Li-juan (College of Materials Science and Engineering, Henan University of Science and Technology,Luoyang 471003, China) Abstract: The wetting match performances of SnAgCuRE lead-free solder for surface mount component......
, Ge, Ce, Sb) lead-free solder was treated by rapid cooling and diffusion annealing, the changes of its microstructures and properties were investigated. The results show that, the faster the cooling... ℃, and the eutectic phase of Sn-58Bi disappears fully. Diffusion annealing can remove the coarse crystal of Bi, uniform the microstructure and enhance the mechanical property of Sn-Bi lead-free solder......
of Sn-3.5Ag-2Bi lead-free solder ZENG Ming1, 2, CHEN Zheng-zhou2, SHEN Bao-luo1, XU Dao-fen2 (1. College of Materials Science and Engineering, Sichuan University, Chengdu 610065, China; 2. College... (A) of Sn-3.5Ag-2Bi lead-free solder were measured, and the constitutive equation of the indentation creep steady-state creep rate was derived. The law that indentation creep changes with the stress......
; Capillary wave formation on excited solder jet and fabrication of lead-free solder ball ZHANG Shu-guang(张曙光), HE Li-jun(何礼君), ZHU Xue-xin(朱学新... vibration was obtained. Sn-4.0Ag-0.5Cu lead free solder ball was successfully produced with tight distribution and good sphericity. The excited jet breakup process is promising for cost effectively......
