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features of LSS alloy are beneficial to the higher thermal conductivity and lower thermal expansion coefficient at room temperature. The fine Si particle in SD alloy is advantageous to improving the mechanical properties. The increasing rates of thermal expansion coefficient with temperature are influenced by the distribution of the Si particles, where a lower rate is obtained in SD alloy......
SiO2层对Al/SiC电子封装材料热膨胀系数的影响[J]. 硅酸盐通报, 2009, 28(1): 71-75.WANG Tao. Influence of interface on the coefficient of thermal expansion of Al/SiC electronic packaging composite[J]. Bulletin of the Chinese...合材料的热膨胀系数,但前者起主导作用；金刚石和碳化硅在不同配比下的热膨胀系数随着复合材料中碳化硅含量的增加逐渐增大,Terner模型与Kerner模型的计算平均值能较好地预测实验结果. 关键词:复合材料；金刚石；碳化硅；热膨胀 中图分类号:TB333 文献标志码:A Thermal expansion behavior of diamond......
results showed that Dy2O3 and Al2O3 had a positive effect on the coefficient of thermal expansion of glass, whereas, SiO2 had a negative effect. The coefficient of thermal expansion of glass showed an apparent linear relation to the contents of these three raw materials, from which an estimation model was built, to calculate the coefficient of thermal expansion of sealing glass. Relative errors......
of aging temperature. The coefficient of thermal expansion (CTE) between room temperature and 100 ℃ of the AlSi27 alloy increases gradually with the increase of aging temperature. On the other hand, the CTE... residual stress; coefficient of thermal expansion 铝硅合金由于具有高热导率,低密度,以及与微电子系统相匹配的低热膨胀系数等优点,被广泛应用于电子封装领域[1-3].在电子封装中,封装壳体的热膨胀系数是一个关键的性能参数,近几年来得到了很多学者的重视和研究[4-6].他们一致认为,铝硅合金的热膨胀系数主要取决于合金中的硅含量,随着硅含量增大,材料的热膨胀系数......
/Al composites have a low density of 2.93 g/cm3, and its relative density is 98.7%. Thermal conductivity of the composites is 175 W/(m·K), coefficient of thermal expansion (CTE) is 10.3×10-6 K-1... conductivity; coefficient of thermal expansion 1 Introduction Electronic packaging shell is an important component in integrated circuit chip packaging. The failure rate of a single component in the chip......
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composites; Coefficient of thermal expansion (CTE); Microstructure; Heat treatment; [全文内容正在添加中] ......
frictional behavior. Key words: C/C composites; thermal expansion coefficient; thermal stress filed; frictional behavior 炭/炭复合材料作为飞机制动材料始于20世纪70年代初期,由于其具有高比强,高比模,低密度,优良的导热性能和摩擦性能以及高承载能力,使用寿命长等突出优点,在20世...树脂炭试样具有相对稳定的摩擦曲线,在较大热应力的作用下,光滑层热解炭试样的摩擦曲线不稳定,影响其摩擦性能. 关键词:炭/炭复合材料；热膨胀系数；热应力场；摩擦性能 中图分类号:TB 332 文献标志码:A Effect of thermal expansion on stress field of C/C composites......
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thixoforming; thermal conductivity; coefficient of thermal expansion 1 Introduction The packaging box is an important structural part used for integrated circuit (IC) seal and signal transmission... in chip speed as well as increasingly lightweight on electronic components, the package box needs high thermal conductivity, proper coefficient of thermal expansion (CTE) matching with chips and lower......
