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separated by shear test shows that for warm bonding the rolling texture disappears on the bond area but the scratch track remain on the bond area for cold bond. There is no gap at the position of interface... and entering temperature of 280 ℃ 4.4 Examination of interface The appearance of the bonded surfaces are observed. In order to identify the bonding features of different samples with different......
particles of Ta-rich phase were also precipitated in NiAl matrix near the interface. Key words: NiAl alloy composite; Al2O3 fibre; diffusion bonding 1 Introduction NiAl alloys are attractive candidate... process or similar powder metallurgy techniques. It is well known that, the mechanical properties of composites are influenced by the bonding strength and microstructure of interface between......
precipitation(SIP) is sufficient under this condition, further impeding the healing of bonding interface.Hence, the joints obtained at low strain rate fractured at the bonding interface easily.Whereas...Dynamic recrystallization behavior and interfacial bonding mechanism of 14Cr ferrite steel during hot deformation bondingLiying Zhou1,2,Wenxiong Chen1,2,Shaobo Feng1,Mingyue Sun1,3,Bin......
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strain of 0.22, without degrading the fine grain and nanoparticle distribution, and the presence of inclusions or micro-voids along the bonding interface. Moreover, the joints had nearly the same... was the dominant nucleation mechanism. The nuclei will grow with ongoing deformation, which will contribute to the healing of the original bonding interface.关键词:......
Bonding Interface of W-CuCrZr Explosively Welded Composite Plates for Plasma Facing ComponentsCongxiao Sun,Shuming Wang,Wenhao Guo,Weiping Shen,Changchun GeDepartment of Materials Science... changed periodically from flat-wavelet to a large wave and finally to a stable wave, which began with the detonation point. The bonding strength of the specimens is higher than 32.9 MPa. Welding hardening......
are achieved through diffusion bonding performed in the temperature range of 1 073 to 1 173 K under the applied stress of 100 MPa for 2 h. 2) The interface is composed of two zones, and its width increases.... 3) In the bonding process, the diffusion of Ti atoms in interface is mainly controlled by grain boundary diffusion. 4) When the joint is bonded at 1 153 K for 2 h, a sound metallurgy joining......
, NiFe2O4 ceramic powder and Cu-Ag alloy powder as filler. The reaction process of Al(H2PO4)3 and CuO was analyzed. The microstructures of bonding interface were investigated. The bonding mechanism... structures at different temperatures, and decompose into CuO and P2O5 at temperature range of 960-1 000 ℃. The phosphate and NiFe2O4 cermet bonding interface remains closely connected state at different heat......
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at the interface of steel-aluminum solid to liquid bonding under rapid solidification, the interface of bonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationship between bonding parameters (such as preheat temperature of steel plate, temperature of aluminum liquid and bonding time) and thickness of Fe-AI compound layer at the interface was established by artificial neural......
