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限会导致工件需按批量分别运输的实际情况,研究以最小化总完工时间为目标的带工件批量运输的加工,运输,装配三阶段装配集成调度问题(three-stage assembly integrated scheduling problem with job batch transportation, 3sAISPJBT)和求解算法.首先,分阶段建立3sAISPJBT的数学模型;其次,分别提出求解运输,装配阶段对应子问题的先完工先运输(first completed first transported, FCFT)规则和先到先装配(first come first assembly, FCFA)规则,以降低求解3sAISPJBT的整体计算复杂度;再次,提出一种融合多种规则的混合分布估计算法(hybrid estimation of distribution algorithm with rules......
that,flex-on-board (FOB)assembly is to attach thin-film adhesives between rigid and flexible substrates in current wearable electronics,such as smart watches[2]. FOB is an alternative interconnection......
are that the after-glow emission spectra exist two bands at about 400 nm and 517 nm and the relative strengths of these two bands can be adjusted by changing the assembly methods and the assembly concentration......
in which the phosphor particles are typically embedded, the by far highest temperatures within the LED assembly are reached within the color conversion element. Based on a combined optical and thermal......
新颖CMOS图像传感器刻蚀工艺进展Tao Zhong,Ying Huang,Chih-Hsun Hsu,Scott Williams,Benjamin Schwarz摘 要:称为背照式(BSI)CIS的新颖CIS比传统的前照明(FI)CIS对光更敏感,且噪声小.BSI刻蚀中的关键参数是侧壁剖面角,微沟槽形成和硅损宏观负载效应.本文中,采用Applied CenturaAdvantEdgeTM MesaTM刻蚀室开发BSI CSI刻蚀工艺.调整C4F8流量可实现侧壁角的目标剖面.调整压力使BSI焊盘底部处微沟槽形成最小.对于硅损的宏观负载,DC(Div.Cap)和MRAD(Motorized Radial Assembly Dial)调整能实现最小的硅损失,有良好的均匀性.关键词:......
to modify the surface charging of the components for hybrid assembly. The obtained powder was coated on ceramic tiles and fired at 900 ℃ to fabricate photocatalytic ceramic. Experimental results show......
supramolecular assembly ofα-ZrBP.关键词:......
in which the phosphor particles are typically embedded, the by far highest temperatures within the LED assembly are reached within the color conversion element. Based on a combined optical and thermal......
of Science and Technology摘 要:The rational assembly of quantum dots on two-dimensional(2 D) carbonaceous materials is very promising to produce materials, but remains a challenge. Here, we develop an assembly strategy of growing Na3 V2(PO4)3 quantum dots with superlattice structure(NVP-QDs-SL) for obtaining precise control of the size, distribution......
基于粒子群算法的复杂产品装配序列规划于宏1,王成恩2,于嘉鹏2,袁辉21. 东北大学机械工程与自动化学院2. 东北大学流程工业综合自动化教育部重点实验室摘 要:根据复杂产品装配规划问题的特点和要求,提出了一种求解装配序列规划(assembly sequenceplanning,ASP)问题的粒子群优化算法,将通常用于连续空间优化的粒子群算法成功扩展到ASP领域.算法根据ASP问题决策解的特点,在排序空间定义了微粒的位置和速度以及相关的各种操作.针对基本粒子群算法容易陷入局部最优的缺点,采用新的学习机制,增强了算法的寻优能力.基于干涉矩阵,连接矩阵和支撑矩阵建立了以装配可行性,装配体稳定性和装配方向改变为评价指标的目标函数.最后通过实例分析验证了该算法的有效性.关键词:装配序列规划;智能优......
