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of SnPb solder, but its creep resistance is worse than that of the other lead-free solders. Particle-reinforcement is a way to improve the creep resistance of solder alloys and cause much more... movement so that the creep rupture life of the composite solder joints is improved. At the same time, Ag-Sn IMC layer formed between the matrix and Ag particles is found from Fig.5(c), which coats Ag......
): 138-144. [5] Su Y A, Tan L B, Tee T Y, et al. Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP[J]. Microelectronics Reliability, 2010, 50(4): 564-579. [6] Wang Y W, Lin Y W.... Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites[J]. Thin Solid Films, 2006, 504(1/2): 401-404. [58] 韩永典. Ni涂层碳纳米管增强Sn-Ag-Cu无铅钎料的可靠性研......
鑫. 微观压痕法测量 Sn-Ag-Cu 系无铅钎料的力学性能[J]. 中国有色金属学报, 2005, 15(5): 688-693. WANG Feng-Jiang, QIAN Yi-Yu, MA Xin. Measurement of mechanical properties of Sn-Ag-Cu series lead-free solder alloy by using micro...]. Soldering & Surface Mount Technology, 2010, 22(2): 30-36. [51] YU D Q, ZHAO J, WANG L. Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder......
; potentiodynamic polarization; leaching behavior; corroded products 1 Introduction Nowadays, to develop lead-free solders to replace lead-bearing solders, many progresses have been achieved in Sn-Ag, Sn-Zn... on the corrosion property of solders can not be ignored. For example, the corrosion property of Sn-Ag-Cu, Sn-Ag-Cu-Bi and Sn-Pb solder joints in deionized water was researched by CHANG et al [10......
Sn3.0Ag0.5Cu/Cu无铅焊点剪切断裂行为的体积效应田艳红1,杨世华1,王春青1,王学林1,林鹏荣1(1.黑龙江省哈尔滨市哈尔滨工业大学现代焊接生产技术国家重点实验室)摘 要:采用直径范围为200-600μm的Sn3.0Ag0.5Cu无铅钎料球在Cu焊盘上制作热风重熔焊点,将重熔焊点在150℃下进行老化,并对重熔和老化焊点进行剪切测试.结果表明:重熔和老化后焊点的剪切强度都随体积的增大而减小,表现出显著的体积效应.SEM断面观察显示:较小体积焊点剪切断裂发生在钎料块体内部,表现出较好韧性;较大体积焊点则发生在近焊盘的界面处,呈现脆性断裂特征.焊盘界面处和钎料内部微观组织SEM观察表明:小体积焊点内部Ag3Sn化合物以小颗粒状弥散分布,起到强化作用;而大体积焊点内部Ag3Sn化合物为树枝网状分布,表......
, 2010, 504: L5-L9. [4] SU Y A, TAN L B, TEE T Y. Rate-dependent properties of Sn-Ag-Cu based lead free solder joints[C]//Electronic Packaging Technology Conference. Singapore: IEEE Inc, 2009: 283-291.... REFERENCES [1] ANDERSON I E. Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications[J]. J Mater Sci: Mater Electron, 2007, 18: 55-76. [2] 张新平, 尹立孟, 于传宝. 电子和光子封装无铅钎料的研究和应用进展......
]. Electronic Components and Materials, 2014, 33(1): 56-59. [7] ZHANG X P, YU C B, ZHANG Y P, SHRESTHA S, DORN L. Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing..., XIAO X. Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys[J]. Journal of Materials Science. 2011, 46(10): 3424-3429. [6] 尹立孟, 姚宗湘, 耿燕飞, 林捷翔, 陆宇浩. Sn-0.3Ag-0.7Cu 低银无铅......
液态Sn-2.8Ag0.5CuX钎料性能的研究 付飞1,甘贵生2,陈方1,杜长华1,雷志阳1 (1.重庆理工大学,重庆,400050;2.北京科技大学,北京,100083) 摘要:采用一种新方法制备Sn-2.8Ag0.5CuX亚共晶改性钎料,研究液态钎料的工艺性能.发现原子掺杂能显著改善液态钎料的抗氧化性,润湿性和漫流性,而亚共晶的成分设计既能降低钎料成本,又能延长液态钎料在使用过程中的稳定性.在265℃和大气气氛下,液态钎料表面氧化渣的生成速率仅为0.36 mg/cm~2·min;当采用RMA-flux钎剂时,t_0=0.82s,F_3=0.75 mN,扩展率接近78%. 关键词:电子微连接; Sn-Ag-Cu钎料; 液态性能; electronic micro-joining; Sn-Ag-Cu solder; liquid state property; [全文内容正在......
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特性[J]. 特种铸造及有色合金, 2006, 26(9): 604-606.FAN Yan-li, ZHANG Ke-ke, WANG Shuang-qi, CHENG Guang-hui, WANG Yao-li, YU Yang-chun. Wettability of Sn-Ag-Cu lead-free solder containing low Ag for different..., ZHAO Xin-hua. Study on the optimal free-lead solder alloy of Sn-Ag-Cu system[J]. Electronic Components & Materials, 2004, 23(8): 14-21. [4] 张柯柯, 王双其, 余阳春, 王要利, 樊艳丽. Sn-Ag-Cu-RE系无铅钎料与表面贴装元器件的润湿适配性[J......
