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. Leaching of lead from solder material of waste printed circuit boards (PCBs) [J]. Hydrometallurgy, 2012, 121-124: 28-34. [7] SETHURAJAN M, HUGUENOT D, JAIN R, LENS P N L, HORN H A, FIGUEIREDO L H A, van...Trans. Nonferrous Met. Soc. China 30(2020) 3367-3378 Recovery of zinc and lead from Yahyali non-sulphide flotation tailing by sequential acidic and sodium hydroxide leaching in the presence......
with the progress of Rb mining and extraction technology, Rb has attracted more and more attentions and gained wide applications in energy, nonlinear optical crystals, catalysis, medicine, solder, special.... Free phenol that was formed after the decomposition can react with 4-aminoantipyrine in alkaline solution and then oxidized by potassium ferricyanide to form red quinone derivatives. The enzyme......
]. Nonferrous Met(Extract Metall), 2017(2): 19-23. [14] JEON S H, YOO K, ALORRO R D. Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching[J...]. 2019-08-16. [12] 杨洪英, 李雪娇, 佟琳琳, 等. 高铅铜阳极泥的工艺矿物学[J]. 中国有色金属学报, 2014, 24(1): 269-278. YANG Hong-ying, LI Xue-jiao, TONG Lin-lin, et al. Process mineralogy of high lead copper anode slime[J]. The Chinese......
and much shorter lead time [6-8]. Wire arc additive manufacturing (WAAM), using an electric arc as the heat source and metal wire as feedstock based on welding principles, offers the advantage..., the repeated thermal impact can lead to inhomogeneity in the local alloy composition [24]. WAAM structure often has a high level of residual stress and anisotropic mechanical properties [8, 15, 25, 26......
. The thermal cycling reliability of copper pillar solder bump in flip chip via thermal compression bonding[J]. Microelectronics Reliability, 2020,104:13543. [35] KANG Q, HE X, REN S, et al. Effect......
photoactivity[J]. Nanoscale, 2014, 6(12): 6335-6345. [43] WANG S S, WU Z, CHEN J, et al. Lead-free sodium niobate nanowires with strong piezo-catalysis for dye wastewater degradation[J]. Ceramics... oxidation[J]. Nano Energy, 2019, 66: 104127. [55] ZHANG A, LIU Z Y, GENG X H, et al. Ultrasonic vibration driven piezocatalytic activity of lead-free K0.5Na0.5NbO3 materials[J]. Ceramics......
and Performance, 2013, 22: 433-438. [3] MAHMUDI R, ESLAMI M. Shear strength of the Zn-Sn high- temperature lead-free solders [J] Materials Science: Materials in Electronics, 2011, 22(8): 1168-1172. [4] HAGHDADI N...) involve plastic zones with the minimum level of stress, where the stress of these regions tends to be zero, and one can conclude that they are like free surfaces and the specimen is torn. All parts......
. [3] KUNDU M, MAHANTY S, BASU R N. Li3SbO4: a new high rate anode material for lithium-ion batteries[J]. Materials Letters, 2011, 65(7): 1105-1107. [4] KIM J, KOH J H. Improved aging behavior of lead-free (Na, K)NbO3-LiSbO3 piezoelectric actuators[J]. Ceramics International, 2017, 43: S92-S96. [5] 杨祖培, 晁小练. 低温烧结锑酸锂掺杂的五元系压电陶瓷材料及其制备方法: CN 101337814A[P]. 2009-01-07. YANG Zupei, CHAO Xiaolian. Method......
the MnS specimen and the experimental anvil (thermocoupled solder joints) was demarcated. Two groups of K-type thermocouples were welded to the anvil and the specimen at the positions indicated in Fig. 1... of sulfides in free-cutting steel [J]. Journal of University of Science and Technology Beijing, 2010, 32: 1271-1276. (in Chinese). MnS高温应力-应变曲线及其在有限元分析中的应用 金 淼1,于琳琳2,刘鑫刚1,郭宝峰1 1. 燕山大学 先进锻压成形技术与科学教育部重点实......
of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints [J]. Journal of Electronic Materials, 2012, 41: 2478-2486. [24] HAKIMIZAD A, RAEISSI K, ASHRAFIZADEH......
