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systems are adopted in the recycling of CRTs [16,17]. The closed-loop process system refers to the recycling of CRTs by sending waste CRTs to CRT factories to obtain lead and lead-free glasses required... gun, 5%, and a funnel for connecting the panel and the neck, 30% [7-9]. The CRT glass can be divided into low lead glass and high lead glass according to its lead oxide content, the panel......
]. Then, resistivity deviates from linear dependence of temperature owing to the destruction of Peierls distortion in these Sb clusters and the releasing of free electrons bounded by the covalent bond [17... distortion with covalent bonds decreases the density of free electrons and increases electron scattering. On the other hand, for Pb atoms and Sb atoms that do not involve in Peierls distortion......
of solder joints[J]. Materials Science and Engineering A, 2003, 358(1/2): 134-141. [23] GUO Y J, QIAO G J, JIAN W Z, ZHI X H. Microstructure and tensile behavior of Cu-Al multi-layered composites......
): 1319-1324. LI Yuan-shan, CHEN Zhen-hua, LEI Xiao-juan. Influence of rapid cooling and diffusion annealing on Sn-Bi-X solder[J]. The Chinese Journal of Nonferrous Metals, 2007, 17(8): 1319-1324. [21......
of Pb-rich phase particle coarsening in Sn-Pb solder under isothermal annealing-cooling rate dependence[J]. Journal of Materials Research, 2005, 20(6): 1563-1573. [16] BIROL Y. Microstructural......
free of micro-cracking and spalling. The cross- sectional BSE images of the coating (Fig. 1(b)) revealed that the coating with a total thickness of about 41 μm, possessed five distinctive layers. Fig. 1.... These reactions would consume Si element and lead to the deficiency of Si atoms in the pack at the last stage of the co-deposition process. And also, it is considered that the solid state diffusion......
in copper during electroplating on the interlayer reaction to Sn-3.0Ag-0.5Cu lead free solder [J]. Journal of Japan Institute of Light Metals, 2006, 70: 548-553. [22] UEDONO A, MORI K, ITO K, IMAMIZU K... depends on not only the thermodynamic driving force, but also the atom diffusion and its kinetics. Table 2 Standard Gibbs free energies of formation of Cu-Al IMCs [24] It is well known......
solder dross [J]. Waste Management, 1999, 19(7): 503-507. [9] VAZARLIS H G. Hydrochloric acid-hydrogen peroxide leaching and metal recovery from a Greek zinc-lead bulk sulphide concentrate [J...Trans. Nonferrous Met. Soc. China 27(2017) 2704-2714 Optimization of operating parameters and kinetics for chloride leaching of lead from melting furnace slag Mohammad Hasan GOLPAYEGANI1, Ali Akbar......
of welded joint of 7A52 alloy welded by the solder wire containing Sc and Zr[J]. Ordnance Material Science and Engineering, 2005, 28(3): 26-29. [18] 徐 振, 赵志浩, 李 莹, 董 宇. 钪铒微合金化对7A52合金焊缝组织与性能的影响[J]. 东北大学学报(自然科......
process, which requires a continuous increase in eutectic density via a nucleation mechanism. In this state, deviations of the chemical balance at the solid–liquid interface have been found to lead..., BOYUK U, MARASLI N. The influence of the growth rate on the eutectic spacings, undercoolings and microhardness of directional solidified bismuth-lead eutectic alloy [J]. Current Applied Physics, 2013......
