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during fabrication. Secondly, the larger R, in the SLM process, reveals a larger liquid phase area existing in per unit area, which promotes the evaporation of nickel and changes the phase transition......
J. Cent. South Univ. (2021) 28: 1043-1057 DOI: https://doi.org/10.1007/s11771-021-4678-x Hall-Petch relationship in selective laser melting additively manufactured metals: using grain or cell size? WANG Yin(王银), WANG Yue-ting(王悦婷), LI Rui-di(李瑞迪), NIU Peng-da(牛朋达), WANG Min-bo(王敏卜), YUAN Tie-chui(......
of the laser scan strategy on grain structure and cracking behaviour in SLM powder-bed fabricated nickel superalloy [J]. Journal of Alloys and Compounds, 2014, 615: 338-347. DOI: 10.1016/j......
of Thermal Spray Technology, 2010, 19(6): 1195-1205. [17] FUKUMOTO M, HUANG Y. Flattening mechanism in thermal sprayed nickel particle impinging on flat substrate surface[J]. Journal of Thermal Spray..., 2018(10): 123-124. [24] 张亚楠. 结晶器铜板表面镍基自润滑涂层的制备及性能研究[D]. 西安: 西安建筑科技大学, 2018: 33-38. ZHANG Ya-nan. Preparation and properties of nickel-based self-lubricating coating on mold copper plate[D]. Xi’an: Xi......
of the sulfates of copper, iron(II), iron(III), nickel, and zinc: XPS, SEM, DRIFTS, XRD, and TGA study [J]. Applied Surface Science, 1999, 152: 219-236. [35] SANDSTROM A, SHCHUKAREV A, PAUL J. XPS......
on the hot deformation behavior of HIPed P/M nickel-base superalloy FGH96[J]. Materials Science and Engineering A, 2011, 528(12): 4030-4039. [18] EBRAHIMI R, NAJAFIZADEH A. A new method for evaluation of friction in bulk metal forming[J]. Journal of Materials Processing Technology, 2004, 152(2): 136-143. [19] TAN L M, LI Y P, HE G A, et al. Optimized hot workability of a powder metallurgy nickel-base......
Science, 2018, 141: 19-29. DOI: 10.1016/j.commatsci.2017.09.015. [33] GONG Y D, ZHONG Z X, ZHOU Y G, SUN Y. Research on the nanometric machining of a single crystal nickel via molecular dynamics......
and silver powders from anode slime containing copper, nickel, tin, and zinc[J]. Gold Bulletin, 2019: 69-77. [15] 万 雯, 杨斌, 刘大春. 硒的现状及其工艺研究[C]// 全国真空冶金与表面工程学术会议. 2005: 72-75. WAN Wen, YANG Bin, LIU Da......
in nickel particle reinforced lead-free composite solder[J]. Electronic Components and Materials, 2007, 26(9): 43-46. [35] 卫国强, 况敏, 杨永强. Cu颗粒增强的Sn-9Zn复合钎料/Cu钎焊接头界面反应[J]. 焊接学报, 2007, 28(5): 105-108. WEI... V L, Rao B S S C, Sarkar R, et al. The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn-Ag lead free solder alloy[J]. Journal of Alloys and Compounds, 2012......
background and tectonic evolution of Jinchuan copper nickel sulfide deposit, Gansu Province, and the time nodes of tectonic evolution and mineralization in Jinchuan mining area were precisely determined......