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• THE CONSOLIDATION OF QUASICRYSTALLINE POWDER UNDER SUPERHIGH PRESSURE'

  来源： 《中国有色金属学报(英文版)1991年第1期》——Chen Zhenhua Huang Peiyun Jiang Xianyang Wang Yun Zhou Duosan

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• Solvent de-binding of water-soluble binder in powder injection moulding

  来源： 《中国有色金属学报(英文版)1999年第3期》——李松林 黄伯云 曲选辉 李益民

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• Chemistry principles for thermoplastic polymer binder formula selection for powder injection molding

  来源： 《中国有色金属学报(英文版)2004年第4期》——梁叔全 唐艳 黄伯云 李少强

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• PREPARATION OF ULTRAFINE NICKEL POWDER

  来源： 《中国有色金属学报(英文版)1996年第2期》——Chai Liyuan Zhong Haiyun

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• UPPER BOUND METHOD FOR SINTERED POWDER MATERIALS IN PLANE STRAIN

  来源： 《中国有色金属学报(英文版)1994年第2期》——Hua Lin Zhao Zhongzhi

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• Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints

  来源： 《中南大学学报(英文版)2016年第8期》——赵国际 文光华 盛光敏 景彦霞

  J. Cent. South Univ. (2016) 23: 1831-1838 DOI: 10.1007/s11771-016-3237-3 Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints ZHAO Guo-ji(赵国际)1,2, WEN Guang-hua(文光华)1, SHENG Guang-min(盛光敏)1, JING Yan-xia(景彦霞)1 1. College of Materials Science and Engineering, Chongqing University, Chongqing......

• Joining of SiC_p/Al composites by insert powder layers

  来源： 《中国有色金属学报(英文版)2005年第5期》——黄继华 董月铃 万云 张建纲 周国安

  Article ID: 1003-6326(2005)05-1067-05 Joining of SiCp/Al composites by insert powder layers HUANG Ji-hua(黄继华), DONG Yue-ling(董月铃), WAN Yun(万 云), ZHANG Jian-gang(张建纲), ZHOU Guo-an(周国安... to reactive diffusion bond SiCp/6063 MMC. The results show that SiCp/6063 MMC joints bonded by the insert layer of the mixed Al-Si powder have a dense joining layer with a typical hypoeutectic......

• Wettability of SnCuNi-xEu solders and mechanical properties of solder joints

  来源： 《Journal of Rare Earths2014年第12期》——张亮 田磊 郭永环 孙磊 闵勇

  Wettability of SnCuNi-xEu solders and mechanical properties of solder joints张亮1,2,田磊3,郭永环1,孙磊1,闵勇11. School of Mechanical and Electrical Engineering, Jiangsu Normal University2. Department... enhance the properties of solder and solder joints, with the increase of Eu content, tendency of first increase and then decrease could be found in the wetting time, wetting force and the mechanical......

• Wettability of SnCuNi-xEu solders and mechanical properties of solder joints

  来源： 《JOURNAL OF RARE EARTHS2014年第12期》——张亮 田磊 郭永环 孙磊 闵勇

  Wettability of SnCuNi-xEu solders and mechanical properties of solder joints张亮1,2,田磊3,郭永环1,孙磊1,闵勇11. School of Mechanical and Electrical Engineering, Jiangsu Normal University2. Department... enhance the properties of solder and solder joints, with the increase of Eu content, tendency of first increase and then decrease could be found in the wetting time, wetting force and the mechanical......

• Parameter fitting of constitutive model and FEM analysis ofsolder joint thermal cycle reliability for lead-free solder Sn-3.5Ag

  来源： 《中南大学学报(英文版)2009年第3期》——周萍 胡炳亭 周孑民 杨莺

  J. Cent. South Univ. Technol. (2009) 16: 0339-0343 DOI: 10.1007/s11771-009-0057-8 Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag ZHOU Ping(周 萍), HU Bing-ting(胡炳亭), ZHOU Jie-min(周孑民), YANG Ying(杨 莺) (School of Energy Science and Engineering, Central South University, Changsha 410083, China)   ......