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• EFFECTS OF Zn CONCENTRATION ON WETTABILITY OF Sn-Zn ALLOY ON Cu AND ON THE INTERFACIAL MICROSTRUCTURE BETWEEN Sn-Zn ALLOY AND Cu

  来源： 《Acta Metallurgica Sinica2006年第4期》——L. Zhou X.Q. Wei H.Z. Huang G.L. Guo X.D. Liu

  of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The nonequilibrium melting behaviors of a series of Sn-Zn alloys were examined by differential thermal analysis. It was found...%. The total thickness of the reaction layer(s) between the alloy and Cu was found to increase linearly with the Zn concentration. Key words:lead-free solder; Sn-Zn alloy; wettability; interface......

• Cu-Ni-Si系引线框架用铜合金成分设计

  来源： 《中国有色金属学报1999年第4期》——曹育文 马莒生 唐祥云 王碧文 王世民 李红

   ......

• Mechanical and electrical properties of In-Bi solder at Bi₂₂₁₂ superconductor interface with annealed Ag spray layers and Ag precoating layers

  来源： 《中国有色金属学报(英文版)2009年第4期》——Seung-Yong SHIN Ji-Hyun LEE Hai-Woong PARK

  -free solder alloy-Cu interface by Ag precoating [J]. J Alloys and Compounds, 2003, 360: 217-224. [9] UELTZEN M, MARTINEK I, SYROWATKA F, FLOEGEL-DELOR U, RIEDEL T. Soldered Ohmic contacts... superconductor-In base solder soldering [J]. J Kor Inst Surf Eng, 2006, 39: 57-63. [11] MURRAY J L, BENNETT L H, BAKER H. Binary alloy phase diagrams [M]. American Society for Metals, 1986: 34. [12] LIN J......

• 非对称结构Cu/Sn-58Bi/Cu焊点中 电迁移致组织演变及损伤

  来源： 《中国有色金属学报(英文版)2014年第5期》——岳 武 秦红波 周敏波 马 骁 张新平

  along grain boundaries, interfaces or surfaces in a polycrystalline alloy. The study on the electromigration behavior in SnPb solder strips showed that the interface between Sn and Pb phases served as the fastest kinetic path [18] and another work indicated that the eutectic Sn-58Bi solder exhibited similar electromigration characteristics to eutectic Sn-Pb alloy [19]. Thus, in the Cu/Sn-58Bi/Cu......

• EBGA焊点形态预测与可靠性分析

  来源： 《中国有色金属学报2003年第4期》——褚卫华 陈循 陶俊勇 王考

  ......

• Finite element simulation for mechanical response of surface mounted solder joints under different temperature cycling

  来源： 《中国有色金属学报(英文版)2001年第4期》——马鑫 钱乙余 F. Yoshida

  ......

• 晶圆级芯片尺寸封装Sn-3.0Ag-0.5Cu焊点跌落失效模式

  来源： 《中国有色金属学报(英文版)2016年第6期》——黄明亮 赵宁 刘爽 何宜谦

  on the mechanical properties and microstructural stability of Sn-Ag-Cu solder alloy under high-temperature annealing [J]. Journal of Electronic Materials, 2013, 42(3): 470-484. [14] TUMNE P, VENKATADRI V...Trans. Nonferrous Met. Soc. China 26(2016) 1663-1669 Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package Ming-liang HUANG1, Ning ZHAO1, Shuang LIU1, Yi-qian HE2 1......

• Correlations between IMC thickness and three factors in Sn-3Ag-0.5Cu alloy system

  来源： 《中国有色金属学报(英文版)2007年第4期》——孟工戈 T. Takemoto H. Nishikawa

  accelerates the crystallization and growing up of IMC. Key words: lead-free solder; Sn-Ag-Cu alloy; IMC thickness; uniform design              ...-free systems have been developed. Among the various alloy systems being considered as lead-free solder candidates, Sn-Ag-Cu alloys have been recognized as the most promising material because......

• Bi对Sn-Zn基无铅钎料合金组织与性能的影响

  来源： 《有色金属2010年第4期》——陈伟 胡强 张富文

  Bi对Sn-Zn基无铅钎料合金组织与性能的影响陈伟1,胡强1,张富文2(1.北京市北京有色金属研究总院国家有色金属复合材料工程技术研究中心2.北京康普锡威焊料有限公司,北京 100088)摘 要:在Sn-(5~9)Zn二元钎料合金中加入1%~3%的Bi,研究Sn-Zn-Bi三元钎料合金的组织,熔化特性及润湿性.在Sn-Zn二元钎料合金结晶过程中,Sn-(5~7)Zn二元钎料合金形成富β-Sn的初生相,随着Zn量的增加,Sn-Zn二元钎料合金形成富Zn的初生相.添加Bi明显改善了钎料合金的润湿性能,当Bi添加量为......

• Thermo-mechanical fatigue reliability optimization of PBGA solder joints based on ANN-PSO

  来源： 《中南大学学报(英文版)2008年第5期》——周继承 肖小清 恩云飞 陈妮 王湘中

  J. Cent. South Univ. Technol. (2008) 15: 689-693 DOI: 10.1007/s11771-008-0128-2 Thermo-mechanical fatigue reliability optimization of PBGA solder joints based on ANN-PSO ZHOU Ji-cheng(周继承)1, 2... network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The simulation experiments......