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; 文献标志码:A 根据国际半导体技术发展路线图(International technology roadmap for semiconductors, ITRS)2014版的预测,超大规模集成电路还将延续Moore定律迅速发展.伴随集成度的提高,特征尺寸的减小以及各种新材料,新工艺的不断涌现,对化学机械抛光/平坦化(Chemical mechanical polishing...-chun. Chemical mechanical polishing: theory and experiment[J]. Friction, 2013, 1(4): 306-326. [3] DUBOIS C, SYLVESTRE A, CHAABOUNI H, FARCY A. Impact of the CMP process on the electrical properties......
and agglomeration of the as-prepared composite microspheres were characterized by XRD, TEM, FESEM, FT-IR and TGA. The as-prepared composite microspheres were collocated into polishing abrasives for chemical mechanical polishing (CMP) of silicon dioxide dielectric layer. The morphologies of the dielectric layer after polishing by the composite abrasives were investigated by AFM. The results indicate......
SiC单晶片CMP超精密加工技术现状与趋势 李淑娟1,李言1,肖强2 (1.西安理工大学机械与精密仪器工程学院,西安,710048;2.西安理工大学机械与精密仪器工程学院,西安710048;3.西安工业大学机电工程学院,西安710032) 摘要:综述了半导体材料SiC抛光技术的发展,介绍了SiC单晶片CMP技术的研究现状,分析了CMP的原理和工艺参数对抛光的影响,指出了SiC单晶片CMP急待解决的技术和理论问题,并对其发展方向进行了展望. 关键词:SiC单晶片; 化学机械抛光; 粗糙度; 抛光效率; SiC mono-crystal; CMP; Roughness; Polishing efficiency; [全文内容正在添加中] ......
Effect of Roasting Conditions of Rich Cerium Rare Earth Carbonate on Crystallite Morphology and Polishing Ability of Ceria-Based Rare Earth Oxide吴文远,李学舜,陈杰,杨国胜,涂赣峰摘 要:polishing experiments found that the polishing ability of the ceria-based rare earth oxide was the best......
文献标志码:A Preparation and polishing performance of polystyrene-ceria and polystyrene-silica composite with novel core-shell structure CHEN Yang1, LONG Ren-wei1, CHEN Zhi-gang2... analysis (TGA). The thermal oxide film covered silicon wafer was chemical mechanical polished (CMP) by composite abrasives, and the polishing behavior of the novel composite abrasives was characterized......
A hydrometallurgical method of energy saving type for separation of rare earth elements from rare earth polishing powder wastes with middle fraction of ceriaUM Namil1,HIRATO Tetsuji21. Resource...="ChDivSummary">This study described a hydrometallurgical method to investigate the separation of rare earth elements(REEs)from rare earth polishing powder wastes(REPPWs)containing large amounts......
A hydrometallurgical method of energy saving type for separation of rare earth elements from rare earth polishing powder wastes with middle fraction of ceriaUM Namil1,HIRATO Tetsuji21. Resource...="ChDivSummary">This study described a hydrometallurgical method to investigate the separation of rare earth elements(REEs)from rare earth polishing powder wastes(REPPWs)containing large amounts......
of Aeronautics and Astronautics, Beijing 100083, China) Abstract:The etching technique using Ce is a convenient and fast method for polishing and shaping diamond films. In this study, the influence of polishing parameters such as polishing temperature and time on the surface crystallinity and phase composition of diamond films was thoroughly investigated via the analysis of Raman spectra......
J. Cent. South Univ. Technol. (2011) 18: 259-265 DOI: 10.1007/s11771-011-0688-4 Evolution of aggregate surface texture due to tyre-polishing CHEN Xian-hua(陈先华)1, B. STEINAUER2, WANG Da-wei(王大为... measured and their developments in polishing process were monitored. The characterizations of height distribution and power spectral density of aggregate surface texture were estimated. The changes......
is chosen as abrasive. The particle size is 15-25 nm and the concentration is 40%. According to the experiment results, pH value is 10.5-11.5. After polishing and cleaning the sapphire surface... is advantageous for epitaxial growth and device making-up. Key words: sapphire; substrate; surface treatment; chemical mechanical polishing; slurry 1 Introduction Sapphire (α-Al2O3) single crystal......