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: lead-free solder; rare earth; tin whisker; morphology 在电子产品的封装互连中,元件引脚一般要镀.... [16] 郝 虎, 田 君, 史耀武, 雷永平, 夏志东. SnAgCuY系稀土无铅钎料显微组织与性能研究[J]. 稀有金属材料与工程, 2006, 35(2): 121?123.HAO H, TIAN J, SHI Y W, LEI Y P, XIA Z D. Studies on microstructure and performance of SnAgCuY lead-free......
properties of Sn1.0Ag0.5Cu lead-free solder[J]. Journal of Materials Science: Materials in Electronics, 2015, 26(1): 613-619. [2] WANG Y W, LIN Y W, KAO C R. Inhibiting the formation of microvoids in Cu3Sn... and mechanical properties of Sn-0.3Ag-0.7Cu lead-free solder[D]. Guangzhou: South China University of Technology, 2014: 1-55. [20] 谭 淇. Fe或Mn对SAC0307钎料性能的影响[D]. 哈尔滨:哈尔滨工业大学, 2014: 1-55. TAN Qi. Effect of iron......
of Materials Science, 2010, 45(2): 287-325. [8] SHALABY R M. Effect of rapid solidification on mechanical properties of a lead free Sn-3.5Ag solder [J]. Journal of Alloys and Compounds, 2010, 505... and microstructure of Sn-Zn lead-free solder [J]. Journal of Materials Science: Materials in Electronics, 2011, 22(5): 481-487. [18] XIAO Z, XUE S, HU Y, YE H, GAO L, WANG H. Properties and microstructure of Sn-9Zn......
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Microstructure and mechanical property of Sn–Ag–Cu solder materialYi-Gang Kong1,Zhi-Gang Kong21. School of Mechanical Engineering, Taiyuan University of Science and Technology2. Research Laboratory of Electrical Contacts, Beijing University of Posts and Telecommunications摘 要:Among the lead-free solder materials,Sn-AgCu alloys have many advantages......
alloy and the Sn-37Pb one. The additions of the different elements investigated in this study do not alter Sn-9Zn''s as-solidified morphology. Key words:lead-free solder; phosphorus; wettability..., Nanchang University, Nanchang 330047, China) Abstract:Eutectic alloy Sn-9Zn is an attractive candidate for lead-free solders. However, its wettability to copper is poor thus,its development was limited......
; 文章编号:1672-7207(2007)01-0030-06 Evolution of intermetallic compounds in SnAg and SnAgCu lead-free solder joints during aging LI Xiao-yan1, YANG Xiao-hua2, WU... layer of IMCs. If the strengths of the solder and IMC are close during aging, the fracture will occur both inside the joints and in the interfacial layer of IMCs. Key words: lead-free solders......
University摘 要:Effects of Zn, Zn-Al and Zn-P additions on melting points, microstructures, tensile properties, and oxidation behaviors of Sn-40 Bi lead-free solder were investigated. The experimental results show that the addition of these three types of elements can refine the microstructures and improve the ultimate tensile strength(UTS) of solder alloys......
Bi对Sn-0.7Cu无铅焊料微观组织和性能的影响 程晓农1,赵国平1,李建新1 (1.江苏大学材料科学与工程学院,镇江,212013) 摘要:研究了Bi对Sn-0.7Cu焊料合金的微观组织,物理性能,润湿性能以及力学性能的影响.结果表明,在Sn-0.7Cu焊料合金中添加适量Bi后,合金的微观组织和性能有较明显的变化,Bi的加入能够降低焊料合金的熔点,提高润湿性能,同时对合金的力学性能也有很大影响,Bi能显著提高合金的抗拉强度,但合金的塑性会有所降低. 关键词:无铅焊料; Sn-0.7Cu; Bi; lead-free solder; Sn-0.7Cu; Bi; [全文内容正在添加中] ......
; 文献标志码:A Effect of Fe particles on microstructures and properties of Sn-3Ag-0.5Cu lead-free solder LIU Xiao-ying, MA Hai-tao, LUO Zhong-bing, ZHAO Yan-hui... increases approximately 25% as a result of incorporation of Fe particles. Key words: composite lead-free solder; Sn-3Ag-0.5Cu; viscosity; wettability; shear strength 为进一步开发新型无铅钎料和改善现有无铅钎料性能,复合无铅钎料的研究已成......
