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J. Cent. South Univ. (2020) 27: 3544-3566 DOI: https://doi.org/10.1007/s11771-020-4509-5 Numerical simulation research on response characteristics of surrounding rock for deep super-large section chamber under dynamic and static combined loading condition FAN De-yuan(范德源)1, LIU Xue-sheng(刘学生)1, 2,......
the MnS specimen and the experimental anvil (thermocoupled solder joints) was demarcated. Two groups of K-type thermocouples were welded to the anvil and the specimen at the positions indicated in Fig. 1......
of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints [J]. Journal of Electronic Materials, 2012, 41: 2478-2486. [24] HAKIMIZAD A, RAEISSI K, ASHRAFIZADEH......
solder alloy [J]. Microelectronics Reliability B, 2014, 54: 1392-1400. [17] FREITAS E S, SILVA A P, SPINELLI J E, CASTELETTI L C, GARCIA A. Inter-relation of microstructural features and dry sliding......
, 19: 3600-3606. [26] OZYUREK D, YAVUZER B, TUNCAY T. The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy [J]. Journal of Adhesion Science Technology, 2016......
solder using nitric acid leaching[J]. Materials Transactions, 2012, 53(12): 2175-2180. [47] SIH V, REIMER B, RATKOVICH A S, et al. Selective nitride etching with phosphoric and sulfuric acid mixtures......
of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061Al using Sn-Ag-Ti active solder [J]. Transactions of Nonferrous Metals Society of China, 2018, 28(4): 748-756. [12] WANG Zhang-wei, BAKER I, CAI Zhong-hou......
. [11] NAZERI M F M, AFFENDY M G, MOHAMAD A A. Corrosion study of Sn-9Zn lead-free solder in alkaline solution[J]. International Journal of Electrochemical Science, 2012, 7(5): 4182-4191. [12] WANG S......
H, TSAI S T, WU P H, et al. Influence of additives on electroplated copper films and their solder joints[J]. Materials Characterization, 2019, 147: 57-63. [49] 徐文柱. 表面活性剂在电镀中的应用[J]. 过滤与分离, 2014, 24(4......
Trans. Nonferrous Met. Soc. China 31(2021) 1529-1549 Microstructure features and mechanical/electrochemical behavior of directionally solidified Al-6wt.%Cu-5wt.%Ni alloy Adilson Vitor RODRIGUES1,2, Thiago Soares LIMA1, Talita Almeida VIDA1, Crystopher BRITO3, Amauri GARCIA1, Noe CHEUNG1 1. Departmen......