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solder dross [J]. Waste Management, 1999, 19(7): 503-507. [9] VAZARLIS H G. Hydrochloric acid-hydrogen peroxide leaching and metal recovery from a Greek zinc-lead bulk sulphide concentrate [J......
of welded joint of 7A52 alloy welded by the solder wire containing Sc and Zr[J]. Ordnance Material Science and Engineering, 2005, 28(3): 26-29. [18] 徐 振, 赵志浩, 李 莹, 董 宇. 钪铒微合金化对7A52合金焊缝组织与性能的影响[J]. 东北大学学报(自然科......
strength of lead-free Sn-Ag and Sn-Bi solder alloys [J]. Science and Technology of Welding and Joining, 2016, 21(6): 429-437. [21] Zhang B, Li H, Zhu Z W, Fu H M, Wang A M, Dong C, Zhang H F, Hu Z Q......
. Development of Sn-based, low melting temperature Pb-free solder alloys [J]. Materials Transactions, 2004, 45: 765–75. [12] DAVOODI A, SALIMIJAZI H, EDRIS H, MOSTAGHIMI J. Study of TLP bonding of Ti-6Al-4V......
in the tensile properties of a Sn-Zn eutectic solder alloy [J]. Materials Science and Engineering A, 2020, 776: 138959. [29] KAKITANI R, GOUVEIA G L, GARCIA A, CHEUNG N, SPINELLI J E. Thermal analysis during......
. Leaching of lead from solder material of waste printed circuit boards (PCBs) [J]. Hydrometallurgy, 2012, 121-124: 28-34. [7] SETHURAJAN M, HUGUENOT D, JAIN R, LENS P N L, HORN H A, FIGUEIREDO L H A, van......
with the progress of Rb mining and extraction technology, Rb has attracted more and more attentions and gained wide applications in energy, nonlinear optical crystals, catalysis, medicine, solder, special......
]. Nonferrous Met(Extract Metall), 2017(2): 19-23. [14] JEON S H, YOO K, ALORRO R D. Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching[J......
deposition of solder bumps for wafer level packaging [J]. Journal of The Electrochemical Society, 2004, 151: C342. DOI: https://doi.org/10.1149/1.1690784. [19] WANG F, WILLIAMS S, COLEGROVE P, ANTONYSAMY AA......
on the width of the center divider. Figure 19 showed that the value of standard deviation varied from 1.8 to 3.1 mm for Section 1, except at the expansion joint, where the bump was seen clearly......